VLC Photonics and ficonTEC to showcase automated die-level testing and assembly
The companies, which will demonstrate new functionalities at Laser World of Photonics in Munich this week, say their collaboration addresses cost and scalability challenges in the PIC industry, accelerating the adoption of PIC-enabled devices
VLC Photonics, a PIC design and test house (part of the Hitachi High-Tech Group), and ficonTEC, a provider of automated assembly and test production solutions for photonics, have announced that they will be demonstrating advanced capabilities in fully automated photonic die-level testing and assembly at Laser World of Photonics 2025, set to take place from 24-27 June in Munich.
Located within the new dedicated integrated photonics area of the event, the companies say they will have a live demonstration showcasing newly implemented functionalities that significantly improve the overall workflow for die-level test and assembly. These capabilities aim to streamline the PIC development process and provide time-to-market benefits for PIC implementation in real-world industrial applications.
According to VLC Photonics and ficonTEC, the new capabilities include: automated loading of PICs from diverse carrier tray formats, thus providing a significant step towards full hands-off operation; enhanced capabilities in automated optical assembly, enabling two-sided PIC assembly of optical fibres and fibre array units (FAUs); the ability to place the PIC in a carrier and perform both horizontal and vertical optical coupling as well as dispense and cure epoxy for robust fibre attachment. Together, the companies say, these functionalities vastly enhance the overall piece-to-piece repeatability during the assembly process.
Since the collaboration began four years ago, VLC Photonics has contributed its expertise in PIC test and assembly to help fully adapt ficonTEC’s testing platforms to the unique challenges of photonics production workflow. The two partners say the synergy between them enables three crucial advancements for the photonics industry: increased throughput for PIC testing, enhanced reconfigurability, and automation of optical testing with high stability and repeatability.
By achieving significant advancements in automation and efficiency, the companies say their collaboration is addressing critical cost and scalability challenges, and is thus poised to accelerate the adoption of PIC-enabled device technology for industrial applications.
