Silicon Austria Labs joins PIXEurope
The research institute will focus on integrating high-performance electro-optic materials such as thin-film lithium niobate and aluminium nitride onto silicon and silicon nitride PIC platforms, enabling ultra-fast modulation, low-power photonic signal processing, and broadband operation (Image credit: Silicon Austria Labs)
Coordinated by ICFO, the PIXEurope pilot line has officially kicked off in Barcelona, aiming to unite leading European research institutions to establish the world’s first open-access PIC ecosystem. Backed by the European Chips Act, the initiative will invest €400 million to accelerate the development and production of photonic chips in Europe, which are critical for next-generation applications in telecommunications, AI, mobility, imaging, and sensing.
By leveraging its expertise in integrated photonic and thin-film integration, Silicon Austria Labs (SAL) aims to contribute to developing scalable, high-performance fabrication processes and ensure smooth technology transfer to industrial partners. A key focus for SAL will be the integration of high-performance electro-optic materials such as thin-film lithium niobate (TFLN) and aluminium nitride (AlN). According to SAL, these materials will be integrated onto silicon and silicon nitride PIC platforms, enabling ultra-fast modulation, low-power photonic signal processing, and broadband operation. Such capabilities are essential to realising next-generation green and efficient photonic technologies.
“Research and technology are the driving forces behind Austria's productivity and competitiveness,” said Peter Hanke, Austrian minister for innovation. “It is therefore important to me to make targeted investments in innovation, even in difficult budgetary times. The PIXEurope pilot line is another strategic milestone for Europe as a technology location. Through Silicon Austria Labs, Austria is once again making a strong contribution to accelerating technological progress, strengthening industrial performance and supporting the EU's goals in the area of digital and green transformation. In addition, the initiative will contribute to the creation of high-tech jobs and strengthen Europe's technological sovereignty.”
Mohssen Moridi, senior director at SAL, commented: “We are proud to be a key player in this pilot line and collaborate with other major players in Europe. Our capabilities in integrating TFLN and AlN onto 200 mm wafer platforms – combined with advanced microfabrication – will unlock new application fields and strengthen Europe’s position in photonic chip innovation.”
PIXEurope aims to advance Europe’s goal to lead in photonic chip development. By enabling faster prototyping, scalable production, and open access to the next generation of photonic technologies, the initiative aims to empower start-ups, SMEs, and established industry players alike to thrive in the fast-evolving digital economy.
