Siemens extends partnership with TSMC
The new collaborations between the companies include joint efforts to help customers leverage TSMC’s silicon photonics technology using Siemens’ tools
Siemens Digital Industries Software has announced it has extended its collaboration with TSMC through new development projects, product certifications and innovative technology enablement for the foundry’s newest process technologies. According to Siemens, mutual customers can develop highly differentiated end-products with confidence using the company’s best-in-class EDA solutions together with TSMC’s industry-leading silicon process and advanced packaging technologies.
“Strengthening our ongoing alliance with Open Innovation Platform (OIP) ecosystem partners like Siemens keeps us at the forefront in accelerating advancements in 3D IC design for AI innovation,” said Dan Kochpatcharin, head of Ecosystem and Alliance Management Division at TSMC. “Our longtime collaboration with Siemens allows our mutual customers to fully harness the power, performance, and efficiency of TSMC's cutting-edge technologies.”
The latest announcement includes an extension of the partnership into the realm of silicon photonics; Siemens and TSMC are working to develop a flow methodology to help customers leverage the foundry’s Compact Universal Photonic Engines (COUPE) silicon photonics technology using Siemens’ tools. The ongoing collaborations include Tanner software custom IC tools for photonics IC design, Xpedition Substrate Integrator software for system assembly and Siemens’ Calibre 3DStack software for the physical verification of the entire COUPE integrated system.
Also included in the announcement are the certification of Siemens’ Calibre nmPlatform tool for TSMC’s N2 and N2P processes; collaboration on the definition and testing of Calibre 3DThermal software, which is Siemens’ newest thermal analysis solution for verification and debugging of advanced 3D-ICs; and an extension of the partnership into the services realm, with Siemens officially joining the TSMC Design Center Alliance (DCA).
“Siemens EDA’s extensive and successful collaboration with TSMC enables advanced solution certifications for the latest process technologies required by our mutual customers,” said Mike Ellow, CEO of Silicon Systems, Siemens Digital Industries Software. “By integrating Siemens' top-tier IC design tools with TSMC's state-of-the-art processes and advanced packaging technologies, we empower our shared customers to achieve groundbreaking and transformative innovations.”
