Loading...
News Article

Intel and Source Photonics partner on 800G transceivers

News

The companies say that their collaboration on transceivers for datacentres and AI infrastructure will offer customers two different designs and manufacturing lines, increasing capacity and improving supply chain security

Source Photonics and Intel have entered into a licensing agreement that allows Source Photonics to utilise Intel’s 800G transceiver designs, including Intel’s silicon photonics chipset, to immediately enable 800G OSFP transceivers for large-scale datacentre and AI infrastructure deployments. Source Photonics says that this silicon photonics-based solution, together with its own in-house EML-based 800G transceiver modules, provides customers with access to two separate 800G designs and manufacturing lines within one company, offering increased supply chain security and higher volume capacity.

“We are excited about this collaboration with Intel,” said John Wang, CEO of Source Photonics. “Our proven transceiver manufacturing expertise, combined with the high-volume, highly reliable silicon photonics technology from Intel, will create enormous value for our customers.”

Amit Nagra, VP/GM of Integrated Photonics Solutions at Intel, said: “This collaboration between Intel and Source Photonics to leverage our transceiver design IP and bring to market products using Intel’s silicon photonics chipset is a validation of our new strategy. As we build upon our strong track record of silicon photonics shipments of over 8 million units to date and continue to develop new silicon photonics technology and products for the datacentre market, collaborations such as this become increasingly relevant.”

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: