+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

The first universal, programmable, multifunctional photonic chip


Researchers from the Universitat Politècnica de València and the company iPronics have reported a photonic chip that they say is the first to allow programming on demand and interconnecting of the photonic and wireless segments of communications networks

A team from the Photonics Research Lab (PRL)-iTEAM of the Universitat Politècnica de València (UPV) and the company iPronics has designed and manufactured a chip that they say will be revolutionary for the telecommunications sector, datacentres, and infrastructure associated with artificial intelligence computing systems. According to the team, it is the first universal, programmable and multifunctional photonic chip in the world and is especially useful for communications, datacentres, quantum computing, artificial intelligence, satellites, drones, and autonomous driving, among many other applications.

This development is the main result of the European UMWP-Chip project, led by researcher José Capmany and financed with an ERC Advanced Grant from the European Research Council. The work has been published in the journal Nature Communications.

According to the UPV and iPRONICS team, the chip they have designed and manufactured allows programming on demand and interconnecting the wireless and photonic segments of the communication networks, avoiding the generation of bottlenecks that can limit both the available capacity and bandwidth.

“It is the first chip in the world with these characteristics,” says Capmany. “It can implement the twelve basic functionalities needed in these systems and be programmed on demand, which results in greater efficiency of the circuits.”

The professor at the UPV, one of the international references in photonics, explains that applications such as 5G or autonomous vehicles require a higher frequency, which is why it is necessary to reduce the size of the antennas and associated circuits. In this case, the PRL-iTEAM of the UPV and iPRONICS report that they have made the converter behind the antenna, which is an interface chip, as small and compact as possible, and that it is prepared to support current and planned future frequency bands.

This chip is already integrated into an iPRONICS product, the SmartLight processor, and is already being used by Vodafone in the testing phase.

“For us, the development of this chip represents a very important step because it has allowed the validation of our developments applied to a growing problem, the efficient management of data flows in datacentres and in the networks of computing systems of artificial intelligence,” says Daniel Pérez-López, co-founder and CTO of iPronics. “Our next objective is to scale the chip to cover the needs of this market segment.”

UniversityWafer announces new supply silicon-on-insulator substrates
Paratus deploys Infinera GX Series in superhighway network
The first universal, programmable, multifunctional photonic chip
Intel Ignite launches its European cohort of Spring 2024
A large-scale photonic chiplet to power artificial general intelligence
Aeva creates Automotive Center of Excellence in Germany
Luceda Photonics releases new Test Design Kit
PhotonVentures’ second fundraising round brings total to €75 million
New edition of IPSR-I photonics roadmap published
Luceda Photonics and Alter Technology collaborate on PIC assembly
Alcyon Photonics and Applied Nanotools collaborate on photonics PDK
Aire Networks deploys Infinera’s ICE-X pluggable solution
Nexus participates in airborne hazard detection project
CMC Microsystems and ventureLAB support semiconductors in Canada
Startups selected for Luminate NY accelerator announced
POET and MultiLane partner on transceivers
Rapid Photonics receives €300,000 for lithium niobate PIC production
Lumentum announces improvements to 800ZR+ transceivers
Teramount and GlobalFoundries cooperate on silicon photonics
StarIC teams up with GlobalFoundries on silicon photonics
Marvell demonstrates 200G 3D silicon photonics engine
Alphawave Semi and InnoLight collaborate on linear pluggable optics
NewPhotonics introduces PIC with integrated optical equaliser
Pilot Photonics secures €2.5 million from European Innovation Council
Ranovus collaborates with MediaTek on 6.4T co-packaged optics
Stellantis Ventures invests in SteerLight silicon photonics LiDAR
Semilux launches programme to develop LiDAR for autonomous vehicles
Coherent recognises Tower Semiconductor with Outstanding Innovation and Technology Supplier Award
photonixFAB Consortium now open for first prototyping
Roadmap to drive PIC industry forward unveiled
European quantum experts team up on photonic quantum computing
OpenLight Partners with VLC Photonics to Expand Design and Test Capacity

Search the news archive

To close this popup you can press escape or click the close icon.
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: