Teramount and GlobalFoundries cooperate on silicon photonics
The company is working to integrate its solution for fibre connectivity to chips with GlobalFoundries’ silicon photonics platform
Teramount, a company focusing on scalable fibre connectivity to chips, has announced that it is collaborating with GlobalFoundries (GF) to address the challenge of connecting fibres to silicon photonics chips, to meet the ever-growing bandwidth demands and power challenges in datacom and telecom applications.
As part of this collaboration, Teramount says it is integrating its Universal Photonic Coupler solution with GF’s 45CLO silicon photonics platform, GF Fotonix, to provide a scalable fibre packaging solution to customers who want to utilise high-speed optical connectivity for AI/ML and datacentre applications. The company says that this collaboration will enable deeper integration of optics into semiconductor through a variety of innovative packaging technologies which provide scalability of bandwidth, power, and latency performance to next generations of advanced computing applications.
“Customers are very impressed with our connectivity solution" said Hesham Taha, Teramount's president and CEO, “and they want to see it supported by leading foundries. GF's feature-rich 45CLO Fotonix platform and position as a leading silicon photonics foundry, make them an ideal partner for high-volume manufacturing of Teramount's solution.”
Gregg Bartlett, chief technology officer at GF, added: “GF Fotonix is paving the way for the future of data connectivity, addressing the rapidly increasing needs for more speed and better power efficiency in the age of AI. Through this collaboration with Teramount we look forward to providing our customers with an additional scalable solution for the future of ultra-fast and efficient data movement.”
