Loading...
News Article

NewPhotonics introduces PIC with integrated optical equaliser

News

The company says its transmitter-optimised chip offers breakthrough minimal latency and power performance for linear receive optics and linear drive pluggable optics applications in the datacentre

NewPhotonics has introduced its NPG102 second-generation photonic integrated circuit with integrated optical equaliser, which the company says delivers reduced complexity and enhanced link performance for high-throughput optical interconnects. According to NewPhotonics, the enhanced transmitter-optimised chip offers breakthrough minimal latency and power performance at 800G and 1.6T for linear receive optics (LRO) and linear drive pluggable optics (LPO) applications in the datacentre.

As AI workloads accelerate the demand for low latency, high speed and power-efficient optical connectivity, LPO benchmarks in power and latency are evolving at consistent link performance required for multivendor interoperability.

The NewPhotonics NPG102 PIC is an octal and quad parallel single mode (PSM) transmitter for 8x and 4x 200G PAM-4 transceivers. The silicon photonics chips monolithically integrate elements of the transmitter including laser, modulator and an optical equaliser. The company says that the best-in-class transmitter design simplifies system integration and improves OEM manufacturing yield and transceiver reliability.

According to NewPhotonics, the optical equaliser located closest to TP2 facilitates signal dispersion compensation that enables consistent optical link performance and interoperability, while optical signal processing enables more than 1000x lower latency resulting in lower system pJ/bit.

“AI continues to drive datacentre processing needs of large language models (LLMs) ramping requirements for low power and low latency fibre connectivity,” said Doron Tal, SVP and GM of Optical Connectivity at NewPhotonics. “The differentiating utility of linear drive and optical equalisation technology enables LPO modules to operate in all ports with different insertion losses ensuring interoperability between different host vendors and enabling a low power, low latency DSP-free alternative.”

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: