Ranovus collaborates with MediaTek on 6.4T co-packaged optics
The companies demonstrated the solution for the AI/ML and HPC markets at OFC 2024 in San Diego
Ranovus, a developer of advanced photonics interconnect solutions for AI/ML infrastructure, has announced it has been collaborating with MediaTek to deliver a 6.4T co-packaged optics solution for MediaTek’s next generation ASIC design platform. This solution is designed to support 6.4T High-Radix optical interconnect for AI/ML SoC and Ethernet applications.
Ranovus says its Odin CPO 3.0 reduces power consumption, footprint, and cost of the system by 50 percent compared with existing solutions. The company’s monolithic Electro-Photonic Integrated Circuit (EPIC) is a single chip that includes 100G TIAs, drivers, silicon photonics modulators and photodetectors. Odin CPO 3.0 includes optical features that enable passive fibre and laser die attach on the EPIC die at scale. Ranovus Odin IP cores are available for development of a new category of application specific optical engines (ASOE) for high-capacity AI/ML workloads.
“The emergence of Generative AI has not only resulted in significant demand for higher memory bandwidth and capacity, but also demand for higher I/O density and speeds,” said Jerry Yu, senior vice president at MediaTek. “Integration of electrical and optical I/O is the latest technology that allows MediaTek to deliver the most flexible leading edge datacentre ASIC solutions.”
Hojjat Salemi, chief business development officer at Ranovus, added: “Working together with MediaTek to realise this next-generation CPO platform has helped usher in a new era for high-density optical interconnect in the AI/ML and Ethernet ecosystem. This platform will play a critical role in accelerating data movement in scale up/scale out AI/ML SoCs and Ethernet.”
