Loading...
News Article

Vanguard Automation signs Agreement to join the Swedish High-Tech Group Mycronic

News

Vanguard Automation GmbH, a developer of technology and automated equipment for 3D nano-printing of photonic interconnects, has signed an agreement to join Mycronic, a Swedish high-tech group, listed on NASDAQ OMX Stockholm.

Mycronic is engaged in the development, manufacturing, and marketing of world-leading and innovative production solutions for the electronics industry. Mycronic is headquartered in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, Singapore, South Korea, the Netherlands, United Kingdom, the United States, and Vietnam.

Vanguard Automation’s area of expertise is adjacent to and complementing that of the die bonding business line in Mycronic’s Global Technologies division. With the addition of Vanguard Automation, Mycronic can offer a wider range of die bonding and photonic packaging related solutions to its customers.

“Joining the Mycronic group marks a pivotal milestone for Vanguard Automation in its mission to deploy 3D nano-printing solutions in volume production for cutting-edge photonic devices. We are looking forward to joining forces with Mycronic’s Global Technologies division, enriching the offerings to our global customer base”, says Thorsten Mayer, CEO at Vanguard Automation.

“Megatrends such as AI, cloud computing and augmented reality are boosting demand for computational power, leading to larger, more energy-intensive data centers. Vanguard Automation’s unique solutions will help speed up photonic interconnects and cut energy consumption at the same time”, says Magnus Marthinsson, Sr VP Global Technologies at Mycronic.

The transaction is expected to be finalized in April 2024, after which Vanguard Automation will form a new business line within the Global Technologies division.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: