+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Quintessent announces $11.5 million in Seed funding

News

The company says the investment will accelerate the development of its technologies to enable scalable, reliable, and sustainable optical interconnects

Quintessent, a start-up focusing on heterogeneous silicon photonics and quantum dot laser technology, has announced that it has closed on just over $11.5 million in an oversubscribed Seed funding round. Osage University Partners (OUP) led the round along with new investors including M Ventures, and joining existing investors Sierra Ventures, Foothill Ventures, and Entrada Ventures.

The proliferation of AI is catalysing a rapid transition and growth of the world’s computing infrastructure from general-purpose architectures to ones specifically designed for accelerated computing. This new paradigm of computing requires the orchestration of massively parallel units of distributed but interconnected compute resources at the cluster or datacentre scale. As a result, data movement efficiency of the interconnecting fabric is a critical bottleneck to accelerating system performance at scale.

Achieving sustainable growth of computing and data movement will require new technologies and architectures that can match the rapid progression of bandwidth (density) scaling from computing and switching interfaces while simultaneously minimising power, latency, fibre count, chip size, and total cost of ownership. In addition, to enable practical deployment at scale and ensure quality of service, significant improvements in reliability relative to today’s solutions are required.

“We are grateful for the support from our new and existing investors who all recognise the need for foundational innovations to catalyse sustainable and reliable interconnect scaling for the era of accelerated computing,” said Alan Liu, CEO and co-founder of Quintessent. “This new funding allows us to grow our team and accelerate the development of highly scalable and highly reliable optical interconnects that transcend the scaling limitations of incumbent solutions, built on top of a unique technology stack including our multi-wavelength comb laser.”

Manny Stockman, a Partner at OUP who will be joining Quintessent’s Board of Directors, commented: “Novel chip-scale laser architectures have rarely been the focus of today’s photonics companies because the industry is still so nascent and focused in on engineered solutions. But at OUP, as we observed various AI and computing hardware companies push the limits of bandwidth and packaging with optical systems, we found they were all challenged by the scaling and cost of their optical laser source. Quintessent’s plans to productise interconnect solutions powered by multi-wavelength quantum dot comb lasers may become one of the most critical product developments in photonics at just the right time to intercept the surging demand for optical connectivity at the largest computing corporations in the world.”

Quintessent announces $11.5 million in Seed funding
EU leaders showcase quantum technology ambitions after signing landmark pact
Broadcom delivers 51.2T co-packaged optics Ethernet switch
Vanguard Automation signs Agreement to join the Swedish High-Tech Group Mycronic
TRUMPF and Optomind showcases 100Gbps VCSEL performance in 800Gbps transceiver at OFC
Infinera announces new line of 1.6T optics for intra-datacentre connectivity
Infinera to Showcase Advances in Optical Networking Solutions at OFC 2024
New etching technique for combining electronics and photonics
EFFECT Photonics Secures $38 Million Series D Funding
Broadcom to demonstrate expanded portfolio at OFC 2024
Celestial AI to exhibit “Photonic Fabric” optical interconnect platform at OFC
Keysight to showcase technologies to accelerate AI at OFC 2024
NTT launches NTT Innovative Devices to advance photonic-electronic convergence hardware
Nubis Communications product receives highest score from Lightwave Innovation Reviews
UK joins EU’s Chips Joint Undertaking programme
Sarcura secures €1.7 million grant from Austrian Research Promotion Agency
The best of both worlds: Design freedom and IP protection
Extremely high-power transmitters for access networks
Tuneable lasers: The elusive trifecta
Three ways photonics can catalyse hardware evolution for datacoms
Lumentum expands Caswell fab, reflecting company-wide plans for growth
Supporting AI with new optical modulators
Moving towards polarisation-independent monolithic PICs
Getting the full PICture: Testing microring resonators with sub-picometre spectral resolution
Lessengers announces portfolio of 800G optics for AI/ML
PhotonDelta and Optics Netherlands launch new “MasterPlus” programme
Marvell CTO receives David Richardson Medal from Optica
Compact chips for converting light into microwaves
Polymer-based material coating with tuneable optical properties
Rose-Hulman Institute of Technology launches NanoEngineering programme
Skorpios Technologies announces additional funding to complete relocation
Quantum Computing Inc. announces new quantum optimisation machine

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: