Loading...
News Article

Kumamoto plant opening poised to shape Japan’s semiconductor landscape

News

TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share.

This figure is expected to climb to around $131.65 billion in 2024, increasing TSMC’s share to 62%. Not only is TSMC leading in revenue, but it has also strategically selected the US, Japan, and Germany as pivotal locations for its advanced and mature factories. Japan is moving at the fastest pace, with some projects even ahead of schedule.

The much-anticipated opening of TSMC’s Kumamoto Plant (JASM) in Japan on the 24th marks TSMC’s debut factory in Japan (Fab-23), signaling a bold step into the future. TrendForce forecasts the plant’s total capacity to hit a robust 40–50K wafers per month (wpm), focusing mainly on 22/28nm processes with a dash of 12/16nm, paving the way for the next phase of the Kumamoto expansion.

Leveraging Its Lead in the Semiconductor Upstream, Japan Eyes a New Semiconductor Era

Japan’s stronghold in the semiconductor industry’s upstream sectors—thanks to leaders like TEL, JSR, SCREEN, SUMCO, and Shin-Etsu—positions it uniquely for the future. TrendForce envisions Japan developing three semiconductor powerhouses in Kyushu, Tohoku, and Hokkaido, with Kyushu taking the lead, especially as the home of TSMC’s Kumamoto plant. Hokkaido’s Rapidus is ambitiously targeting the 2nm process and aiming to spur economic growth. With concerted efforts from industry, government, and academia, Japan is on the brink of creating a comprehensive semiconductor manufacturing ecosystem.

Japan’s semiconductor enterprises are heavily concentrated in Kyushu and Tohoku, with the latter boasting a wealth of talent and a strong focus on semiconductor development at Tohoku University. Highlighting the region’s prominence, companies like ROHM, Renesas, and PSMC are making significant moves, including PSMC’s new 12-inch wafer fab in Sendai. Kyushu’s unparalleled underground water resources, crucial for semiconductor production, have attracted major players like SUMCO and TOK, as well as Sony, ROHM, and Mitsubishi Electric, making it an ideal sport. TSMC’s selection of Kyushu for its expansion was primarily hinged on these water resources.

With the race on for TSMC’s third plant location, other areas in Kyushu like Fukuoka and potentially Osaka in the Kansai region are contenders. Still, in the early planning stages, the project’s future is ripe with possibilities. Initially centered on 6/7nm processes, advancements might lead the third plant to embrace 5nm or 3nm processes as TSMC continues to push the envelope. Beyond this, TSMC’s establishment of a 3DIC research center in Ibaraki and plans for an advanced packaging plant in Japan showcase its commitment to a full-spectrum presence, from front-end manufacturing to back-end packaging and testing, solidifying Japan’s position in the semiconductor sphere.

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: