+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
Vendor View



With its new version of the AMICRA NOVA Pro, ASMPT presents one of the most advanced die bonding systems. The platform, which combines high placement accuracy with short cycle times and innovative bonding technologies.

“For speedy data transmissions for precise sensor technology you need equally precise manufacturing technologies,” explains Johann Weinhaendler, General Manager at ASMPT AMICRA in Regensburg, Germany. “To meet the enormous increase in demand in areas like optoelectronics or advanced packaging many electronics manufacturers are currently upgrading their lines. Demand is growing particularly strongly in the silicon photonics sector. For example, you can produce active optical cables for 400/800 Gigabit/sec networks or co-packaged optics with the NOVA Pro.”

Powerful and adaptable

The NOVA Pro places dies in sizes ranging from 0.1 to 25 millimeters with a maximum accuracy of ±1 micron @ 3σ at speeds of up to 1000 units per hour (UPH). At ±3.0 microns @ 3σ it achieves even 3500 UPH. This impressive level of performance is also achieved in flip-chip mode.

The NOVA Pro ensures its trend-setting placement accuracy with its unique dynamic alignment method in combination with laser-based substrate heating technology. And thanks to its Active Bond Force Control, the machine can dose bonding forces with exceptional precision ranging from 10 g to 5000 g. Using an epoxy resin stamp with volumetric dosing, the dies can be affixed with adhesives that get UV-cured in place. The repertoire of precision die fastening methods includes in-situ bonding as well as eutectic die bonding with a bonding tool (up to 350 °C), a ceramic pulse heater (up to 500 °C), or a contactless laser (up to 450 °C). An integrated post-bond inspection ensures maximum quality. With its very generous substrate area of 550 × 600 mm, the NOVA Pro is aimed at the die-bonding market in advanced packaging applications.

Reliable and versatile

“Anyone who opts for the NOVA Pro benefits from the many years of experience of the market leader, who is fully committed to the goal of zero DPMO,” says Johann Weinhaendler. “The high reserves in terms of precision and performance as well as the flexible fixation and bonding options make this machine a future-proof investment.”

UniversityWafer announces new supply silicon-on-insulator substrates
Paratus deploys Infinera GX Series in superhighway network
The first universal, programmable, multifunctional photonic chip
Intel Ignite launches its European cohort of Spring 2024
A large-scale photonic chiplet to power artificial general intelligence
Aeva creates Automotive Center of Excellence in Germany
Luceda Photonics releases new Test Design Kit
PhotonVentures’ second fundraising round brings total to €75 million
New edition of IPSR-I photonics roadmap published
Luceda Photonics and Alter Technology collaborate on PIC assembly
Alcyon Photonics and Applied Nanotools collaborate on photonics PDK
Aire Networks deploys Infinera’s ICE-X pluggable solution
Nexus participates in airborne hazard detection project
CMC Microsystems and ventureLAB support semiconductors in Canada
Startups selected for Luminate NY accelerator announced
POET and MultiLane partner on transceivers
Rapid Photonics receives €300,000 for lithium niobate PIC production
Lumentum announces improvements to 800ZR+ transceivers
Teramount and GlobalFoundries cooperate on silicon photonics
StarIC teams up with GlobalFoundries on silicon photonics
Marvell demonstrates 200G 3D silicon photonics engine
Alphawave Semi and InnoLight collaborate on linear pluggable optics
NewPhotonics introduces PIC with integrated optical equaliser
Pilot Photonics secures €2.5 million from European Innovation Council
Ranovus collaborates with MediaTek on 6.4T co-packaged optics
Stellantis Ventures invests in SteerLight silicon photonics LiDAR
Semilux launches programme to develop LiDAR for autonomous vehicles
Coherent recognises Tower Semiconductor with Outstanding Innovation and Technology Supplier Award
photonixFAB Consortium now open for first prototyping
Roadmap to drive PIC industry forward unveiled
European quantum experts team up on photonic quantum computing
OpenLight Partners with VLC Photonics to Expand Design and Test Capacity

Search the news archive

To close this popup you can press escape or click the close icon.
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: