Loading...
News Article

Photonic chip built with new lego-like integration technique

News

Image credit: Stefanie Zingsheim/The University of Sydney

Researchers at the University of Sydney Nano Institute have reportedly invented a compact silicon semiconductor chip that integrates electronics with photonic components. According to a paper published in Nature Communications, the new technology significantly expands radio-frequency (RF) bandwidth and the ability to accurately control information flowing through the unit.

The team expect that the chip will have applications in advanced radar, satellite systems, wireless networks, and the rollout of 6G and 7G telecommunications, while also opening the door to advanced sovereign manufacturing. Additionally, it could assist in the creation of high-tech value-add factories at places like Western Sydney’s Aerotropolis precinct.

The chip is built using an emerging technology in silicon photonics that allows integration of diverse systems on semiconductors less than 5 mm wide. Professor Ben Eggleton, who guides the research team, likened it to fitting together Lego building blocks, where new materials are integrated through advanced packaging of components, using electronic ‘chiplets’.

Dr Alvaro Casas Bedoya, associate director for photonic integration in the School of Physics, who led the chip design, said the unique method of heterogenous materials integration has been 10 years in the making.

“The combined use of overseas semiconductor foundries to make the basic chip wafer with local research infrastructure and manufacturing has been vital in developing this photonic integrated circuit,” he said. “This architecture means Australia could develop its own sovereign chip manufacturing without exclusively relying on international foundries for the value-add process.”

Professor Eggleton highlighted that most of the items on the Federal Government’s List of Critical Technologies in the National Interest depend upon semiconductors. He said the invention means the work at Sydney Nano fits well with initiatives like the Semiconductor Sector Service Bureau (S3B), sponsored by the NSW Government, which aims to develop the local semiconductor ecosystem.

Dr Nadia Court, Director of S3B, said: “This work aligns with our mission to drive advancements in semiconductor technology, holding great promise for the future of semiconductor innovation in Australia. The result reinforces local strength in research and design at a pivotal time of increased global focus and investment in the sector.”

Designed in collaboration with scientists at the Australian National University, the integrated circuit was built at the Core Research Facility cleanroom at the University of Sydney Nanoscience Hub.

The researchers say that the photonic circuit in the chip means the device has a 15 gigahertz bandwidth of tunable frequencies, with spectral resolution down to 37 megahertz, which is less than a quarter of one percent of the total bandwidth.

Professor Eggleton said: "Led by our impressive PhD student Matthew Garrett, this invention is a significant advance for microwave photonics and integrated photonics research. Microwave photonic filters play a crucial role in modern communication and radar applications, offering the flexibility to precisely filter different frequencies, reducing electromagnetic interference, and enhancing signal quality.

“Our innovative approach of integrating advanced functionalities into semiconductor chips, particularly the heterogenous integration of chalcogenide glass with silicon, holds the potential to reshape the local semiconductor landscape."

Co-author and senior research fellow Dr Moritz Merklein said: “This work paves the way for a new generation of compact, high-resolution RF photonic filters with wideband frequency tunability, particularly beneficial in air and spaceborne RF communication payloads, opening possibilities for enhanced communications and sensing capabilities.”

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: