+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

EU-funded project focuses on incorporating graphene in PICs

News

The Graphene Flagship initiative has announced a new project funded by Horizon Europe that aims to develop the next generation of sensors and imagers enabled by 2D material digital integration. The Next-2Digits project will focus on the incorporation of graphene and 2D materials (2DM) in PICs and MEMS foundries, enabling future industrial uptake and a significantly shorter time-to-market for 2DM-based devices. The Graphene Flagship initiative is the European Union-funded research and innovation endeavour that aims to bring graphene and related materials from the laboratory to the market.

Coordinated by the National Technical University of Athens, Next-2Digits is a consortium of 11 partners from eight countries, including academic, research and industrial teams. Their areas of work span graphene and 2D materials synthesis, characterisation, manipulation and integration, as well as the fields of photonics, material science, application-based integration technologies and validation. Next-2Digits will run for three years and three months.

Next-2Digits will also collaborate with the GrapheneEU project “Graphene Europe in the Lead Coordination and Support Action”. Developed under the scope of the Graphene Flagship initiative, this partnership provides a platform for collaboration, coordination and support for the Graphene Flagship core projects and associated members. Along with GrapheneEU, Next-2Digits seeks to increase the expertise in the graphene field and spread knowledge among various stakeholders.

About Next-2Digits

Photodetectors (PDs) and modulators (MDs) are essential components of photonic integrated circuits (PICs) and optoelectronic integrated circuits (OEICs).

The introduction of graphene and other two-dimensional materials (2DM) in the pallet of materials compatible with the PIC and OEIC industry has offered a novel paradigm in integrated PDs and MDs with a miniature footprint and ultrawide bandwidth, outperforming the standard materials and architectures. The main challenge, when graphene is deposited, is the introduction of impurities and defects that degrade device performance, especially when polymers and solvents are involved.

In particular, the wafer-scale integration of high-quality and defect free 2DM layers, without disrupting the process-line silicon foundries, has not been demonstrated. Next-2Digits aims to introduce the direct wafer-scale integration of 2DM in PICs using two additive technologies: semi dry transfer of graphene layers for full wafer scale integration and direct die processing; and Laser Digital Transfer of pristine 2DM pixels directly on the stack without the need for post-processing.

By pursuing these developments, the project seeks to enable the incorporation of 2DM in PICs and MEMS foundries, and the industrial uptake of 2DM-based devices.

Nanoscribe introduces novel 3D printing technique for photonics
EU-funded project focuses on incorporating graphene in PICs
Photo-induced superconductivity on a chip
Kulicke & Soffa announces packaging orders supporting AI applications
Avicena showcases compact 1Tbps optical transceiver at SuperComputing 2023
Novel method for making chipscale mode-locked lasers
Luna announces contract supporting hyperscale datacentres
Silicon Austria Labs and EV Group strengthen collaboration
SMART Photonics and imec to collaborate on hybrid integration
TDK Ventures invests in Nubis optical engines
Photonic quantum computing company raises $100 million investment
Ayar Labs showcases optically-enabled Intel FPGA
U.S. Navy funds Mercury to develop photonic chiplet manufacturing capability
Photonics companies call on EU to invest in supply chain
PI announces new alignment system for silicon photonics
DoD awards contract for development of glass photonic interposers
Jabil takes over Intel silicon photonics line
KrellTech announces new GEO processing system for PICs
Lumentum to acquire Cloud Light, expanding provision for data centres
Enablence announces new DWDM optical chips to improve data centres’ bandwidth
SuperLight Photonics introduces new portable wideband laser
NTT and Chunghwa Telecom cooperate on all-photonics network
India and Japan cooperate on semiconductor supply chain
GlobalFoundries hosts event on secure chip manufacturing
NY CREATES and PsiQuantum join forces on integrated photonics research
Optical neural network demonstrated on chip
New consortium seeks to advance photonic quantum computing
Stäubli Award goes to robotics system for assembling photonic modules
Silicon photonics research centre established at Indian Institute of Technology Madras
Researchers report photonic 3D data processing
Micas Networks announces new co-packaged optics switch
NSF funds project to develop photonic chips for navigation

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: