Kulicke & Soffa announces packaging orders supporting AI applications
Kulicke and Soffa Industries (K&S), a semiconductor and electronics assembly company, has announced that it has received multiple orders for its thermocompression bonding (TCB) solutions, primarily supporting silicon photonics (SiPh) based co-packaged optics (CPO) applications deployed in high-bandwidth networking transceivers. The company anticipates a series of follow-on CPO orders to support capacity expansion plans throughout fiscal years 2024 and 2025.
K&S says its packaging solutions are an increasingly critical enabler for leading-edge scaling which is allowing higher-bandwidth networks, faster machine learning applications and more advanced mobility features. The company adds that, in recent years, it has taken share in several key AI growth markets including high-performance computing, CPO, and leading-edge heterogeneous integration applications. It seeks to continue directly supporting the long-term growth of these markets as AI becomes more ingrained into everyday life.
Today, AI is transforming machine learning, network infrastructure and edge-device requirements by demanding capable and cost-effective approaches to support stacked or planar multi-die applications. These heterogeneous, or chiplet, applications are being deployed in high-bandwidth memory; enterprise logic (GPU, CPU, TPU); and high-volume application processors and communications devices. As these markets continue to transition from flip-chip technology, K&S anticipates significant opportunities.
"Our capable, performance-focused advanced packaging solutions are driving significant market interest, as they efficiently address many emerging assembly challenges,” said John Molnar, vice president of K&S. “Our unique solutions provide precision control and critical features, which unlock meaningful value for the most challenging optical, high-volume logic and emerging heterogeneous applications. These recent orders highlight our leadership in TCB, but also validate the growth potential of the emerging advanced packaging marketplace."
