Loading...
News Article

Scientists report integrated photodiodes on TFLN

News

Thin-film lithium niobate (TFLN) is often considered a promising platform for photonic integrated circuits due to its tight mode confinement, high nonlinear efficiency and wide transparency window. Chinese scientists have recently reported an ultra-wideband waveguide-coupled photodiode on the TFLN platform, achieving a 3-dB bandwidth of 110 GHz and a responsivity of 0.4 A/W at 1,550 nm wavelength.

Owing to its strong electro-optic coefficient and wide transparency window, lithium niobate (LN) has become an attractive photonic material. Thin-film lithium niobate (TFLN) technology has enabled tight mode confinement and high nonlinear efficiency. Various compact integrated photonics devices have been realised on the TFLN platform, such as compact high-performance modulators, polarisation management devices, and broadband frequency comb sources. However, the inherent difficulty of creating lithium niobate light sources and photodetectors poses a challenge for the TFLN integrated photonics platform. As an essential optoelectronic component, an on-chip integrated high-performance photodetector is vital for TFLN photonic integrated chips.

In a new paper published in Light: Advanced Manufacturing, a research team, led by Professor Xiaojun Xie and Lianshan Yan from Key Laboratory of Photonic-Electric Integration and Communication-Sensing Convergence, School of Information Science and Technology, Southwest Jiaotong University, China, has reported a high-speed and high-responsivity modified uni-traveling carrier photodiode heterogeneously integrated on the TFLN platform. According to the paper, the device exhibits a 3-dB bandwidth of 110 GHz and a responsivity of 0.4 A/W at a wavelength of 1,550-nm wavelength.

The researchers described the fabrication process as being initialised by the dry etching of LN waveguides and passive devices. A hybrid etching approach was followed to form device mesa. After metal plating and lift-off, the chips were diced and polished. The epitaxial layer structure, LN waveguide geometry, and CPW pad geometry were optimised to achieve both large bandwidth and high responsivity.

To further assess the performance of the devices, the team applied them to a data transmission system, and say they successfully detected PAM4 signals at 32 Gbaud with high quality. The researchers also say they have demonstrated that the heterogeneously integrated photodiodes on the TFLN platform have the potential to be applied in the next-generation high-speed transmission systems.

According to the scientists, this work paves the way to achieving massive-scale, multi-function, and high-performance TFLN photonic integrated circuits, as well as holding promise for ultra-high-speed optical communications, high-performance integrated microwave photonics, and multi-function integrated quantum photonics

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: