ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
ASMPT AMICRA and Teramount have announced a collaboration to address the challenge of connecting fibres to silicon photonic chips, to meet the ever-growing bandwidth demands in datacom and telecom applications. ASMPT AMICRA is a supplier of ultra-high precision die attach equipment that specialises in ultra-high precision die attach solutions, while Teramount is providing a solution for scalable fibre connectivity to photonic chips.
In the rapidly evolving fields of artificial intelligence and high-performance networking, one of the primary challenges has been to achieve seamless fibre-to-chip connectivity. The collaboration between the two companies is based on placement of Teramount’s wafer-level self-aligning optical elements on customers’ silicon photonics wafers using ASMPT AMICRA's precision die attach machineries, and seeks to provide a solution to this long-standing challenge.
“There is a clear demand from customers for high volume silicon photonics manufacturing and packaging," said Hesham Taha, Teramount's president and CEO. "They are keen to see this supported by equipment that’s already used in high volume OSAT environments. ASMPT AMICRA, a front-runner in die-to-wafer attach equipment, is an ideal partner for Teramount to scale up and meet this rising customer demand."
“Silicon photonics is the key technology of our future everyday life,” added Dr. Johann Weinhaendler, Managing Director of ASMPT AMICRA. “The fast transfer of constantly growing amounts of data requires ever increasing accuracy when assembling the semiconductor components. In Teramount we see an optimal expert in the development of high-speed connectivity solutions where we meet each other to incorporate their products via high-precision passive wafer-level assembly of optical lens components.”