+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Advanced Micro Foundry and Ascenta Technologies launch MPW runs

News

Advanced Micro Foundry (AMF) and Ascenta Technologies (Ascenta) have announced a new milestone in their collaboration: The AMF Visible + Infrared (IR) multi-project wafer (MPW) series. AMF is a Silicon Photonics foundry, while Ascenta is a spin-off led by researchers from the Max Planck Institute of Microstructure Physics and the University of Toronto. With this project, the two companies aim to bring a versatile and functional Visible + IR platform to the photonics community.

The visible platform was built using AMF’s expertise in low-loss SiN platform technology, leveraging a multi-layer silicon nitride and silicon stack. AMF says that this platform enables the creation of high-and low-confinement single-mode waveguides, effectively spanning a wavelength spectrum of 400 nm to 1600 nm, as well as active functionalities including photodetectors and highly efficient phase shifters.

AMF partnered with Ascenta to develop a library of Visible and IR photonic components on AMF’s silicon nitride technology platform. The library includes a suite of devices such as low-loss waveguides, fiber-to-chip couplers, photodetectors, thermo-optic phase shifters, MEMS structures, and modulators. This collaborative offering seeks to empower optical designers with the necessary tools to design complex PICs with confidence, paving the way for further innovation.

Both companies are actively aggregating users for MPW runs in 2024. The AMF Visible MPW offering aims to advance visible product development in fields ranging from LiDAR, optical computing, health, and augmented reality.

AMF CTO, Dr. Patrick Lo remarked “I am very excited to see the interest from the community to utilise the wide space of visible applications. AMF is very proud to partner with Prof. Joyce Poon & Ascenta to provide access to this platform via MPW to support the community and grow the market”.

Ascenta CEO, Mr. Ilan Almog added “The Ascenta team is grateful for our partnership with AMF and thrilled to share the VIS+IR silicon photonics platform with MPW participants. The platform is the same fundamental technology Ascenta is using to develop its products, in the 3D sensing space and beyond. We are excited to enable the wide range of applications brought forth by the creativity of the community, leveraging the capabilities in the platform”.

New technique controls direction and wavelength of emitted heat
Santec introduces O-band version of swept photonics analyser
KrellTech expands manufacturing and engineering facility
SuperLight Photonics secures seed funding in investment round
Skorpios Technologies reopens services at new fab facility
Photonic integration and packaging with Photonic Wire Bonding and facet-attached micro-optical elements
Broadband PICs with 3 µm SOI technology
From processing and computing to sensing
Photonic integrated circuit packaging, from prototype to production scale-up
Component viability risks bursting the quantum bubble
Enabling coherent optical communication with InP PICs
Infinera to comply with 'Buy America' requirements
Astrape Networks secures €1.6 million for sustainable data centre
Tower Semiconductor and InnoLight partner on optical transceivers
South Devon College and photonics specialists announce educational project
Axithra raises €10m for biomedical application of photonics
Vector Photonics and Sivers collaborate
PhotonVentures raises €60 million to supercharge photonics startups
Rockley completes human studies of blood pressure monitor
POET to demo 800G optical transceivers at CIOE 2023
Lightwave Logic expands its Colorado operations
Marvell announces new 800 Gbps coherent DSP
Lightelligence to Demonstrate Hummingbird Optical Network-on-Chip
Sandia Labs announces method to integrate microscale optical devices on silicon microchips
Israel-U.S. Binational Industrial R&D Foundation to invest $8 million in 9 new projects
Imec integrates thin-film photodiode into SWIR sensors
Advanced Micro Foundry and Ascenta Technologies launch MPW runs
Going Vertical to Advance PICs
Coherent has shipped over 200 billion VCSELs
Lightelligence Introduces Optical Interconnect for Composable Data Center Architectures
UK consortium to address skills shortages
Could silicon outperform GaAs in photodetectors?

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: