PHIX and Surfix Diagnostics release white paper on biosensor manufacturing
Packaging foundry PHIX has released a new white paper in collaboration with Surfix Diagnostics, which uses photonics technology to develop tests for the early detection of cancer. The paper focuses on the wafer level manufacturing of photonic biosensors with integrated active components. As part of this work, PHIX demonstrates flip chip integration of III-V photonic components and NTC thermistors onto a silicon nitride wafer using a state-of-the-art laser assisted heating process.
This process development for the scalable manufacturing of integrated photonic biosensors is part of the PHOTO-SENS project. PHIX uses its automated pick-and-place equipment fitted with a custom module for laser assisted heating to perform bonding of vertical cavity surface emitting lasers (VCSELs), gallium arsenide (GaAs) photodiode arrays, and NTC thermistors onto a silicon nitride (SiN) photonic platform at wafer level.
After being populated with the active and passive components, a process developed by Surfix Diagnostics subjects the wafer to nanocoating and biofunctionalisation. After singulation, through stealth dicing to keep the coatings intact, the hybrid photonic integrated circuits (PICs) will be integrated with microfluids and read-out electronics to form a photonic biosensing platform.
