Loading...
News Article

Vector Photonics datacoms PCSEL commercialisation to accelerate

News

The commercialisation of Vector Photonics’, 1 Watt, 1310 nm, datacoms PCSEL will accelerate following the award of Zeus; a £1 million industrial research fund for AI laser development. The 1-Watt, all-semiconductor datacoms PCSEL targets the interconnects, silicon photonics and CPO used in next-generation, cloud datacentre applications. Additionally, it can leverage the core, optical power and computer processing technology developed in project Zeus, for AI applications.

Dr. Richard Taylor, CTO of Vector Photonics, said, “An uncooled, 1 Watt PCSEL is a game-changer for cloud datacoms applications. It offers significant, optical power increases over incumbent DFB technology, with countless manufacturing and energy saving benefits. Next-generation, datacentre interconnects are expected to deliver 800Gbps, increasing to 1.6 Tbps and then 3.2 Tbps, over the next decade. The 1 Watt PCSEL enables this development, with a reduction in the laser quantities needed of up to 10 times. The resulting interconnects, silicon-photonic chips and CPO systems become significantly easier to make, with a high likelihood of improved yield and reliability.

“The 1-Watt datacoms PCSEL will positively affect the architecture of all datacoms chips and systems. Power consumption, heat, latency, and manufacturing costs are all reduced, along with operational power savings due to the PCSEL’s symmetrical far-field, making its data transmission more efficient than DFBs.”

PCSELs are increasingly looking like the only realistic enabler of next generation, datacoms applications, where DFBs have met their technological limit.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: