+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Coherent unveils ultracompact VCSEL architecture

News

Patented module approach allows dynamic illumination and sensing with backside-emitting VCSEL arrays

Coherent, a US-based optical sensing company, has unveiled a patented module architecture for compact dynamic illumination and sensing with backside-emitting VCSEL arrays.

The rapidly growing number of applications for optical sensing in consumer electronics is driving the demand for optoelectronic subassemblies that fit in smaller spaces and achieve higher performance.

Coherent says its patented module technology enables ultracompact pattern projectors, flood illuminators, and tightly integrated sensing subsystems. The module technology relies on flip-chip assembly of backside-emitting VCSEL arrays on application-specific integrated circuits (ASICs) and supports the integration of photodetector arrays.

“The flip-chip approach eliminates the parasitic inductance from bond wires, improving the depth resolution and accuracy of time-of-flight sensors in consumer electronics,” said Julie Sheridan CTO. “Backside illumination optoelectronics enables not only the superior electrical performance of flip-chip assemblies, but also a higher level of optical integration with polarisation-locking and beam-shaping features embedded in the optoelectronic device.”

VCSEL arrays from Coherent can be designed to independently address individual or groups of emitters that are steered through diffractive optics, enabling the selective illumination of a region of interest within a dynamic scene.

UniversityWafer announces new supply silicon-on-insulator substrates
Paratus deploys Infinera GX Series in superhighway network
The first universal, programmable, multifunctional photonic chip
Intel Ignite launches its European cohort of Spring 2024
A large-scale photonic chiplet to power artificial general intelligence
Aeva creates Automotive Center of Excellence in Germany
Luceda Photonics releases new Test Design Kit
PhotonVentures’ second fundraising round brings total to €75 million
New edition of IPSR-I photonics roadmap published
Luceda Photonics and Alter Technology collaborate on PIC assembly
Alcyon Photonics and Applied Nanotools collaborate on photonics PDK
Aire Networks deploys Infinera’s ICE-X pluggable solution
Nexus participates in airborne hazard detection project
CMC Microsystems and ventureLAB support semiconductors in Canada
Startups selected for Luminate NY accelerator announced
POET and MultiLane partner on transceivers
Rapid Photonics receives €300,000 for lithium niobate PIC production
Lumentum announces improvements to 800ZR+ transceivers
Teramount and GlobalFoundries cooperate on silicon photonics
StarIC teams up with GlobalFoundries on silicon photonics
Marvell demonstrates 200G 3D silicon photonics engine
Alphawave Semi and InnoLight collaborate on linear pluggable optics
NewPhotonics introduces PIC with integrated optical equaliser
Pilot Photonics secures €2.5 million from European Innovation Council
Ranovus collaborates with MediaTek on 6.4T co-packaged optics
Stellantis Ventures invests in SteerLight silicon photonics LiDAR
Semilux launches programme to develop LiDAR for autonomous vehicles
Coherent recognises Tower Semiconductor with Outstanding Innovation and Technology Supplier Award
photonixFAB Consortium now open for first prototyping
Roadmap to drive PIC industry forward unveiled
European quantum experts team up on photonic quantum computing
OpenLight Partners with VLC Photonics to Expand Design and Test Capacity

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: