Loading...
News Article

Avicena and Ams Osram partner on chip-to-chip interconnects

News

Companies to develop high-volume production of links using densely packed arrays of GaN microLEDs

Sunnyvale-based AvicenaTech has partnered with Ams Osram to develop high-volume manufacturing of GaN microLED arrays for its LightBundle communication architecture.

Avicena’s LightBundle links use densely packed arrays of GaN microLEDs to create highly parallel optical interconnects with typical throughputs of > 1Tb/s at energies of < 1 pJ/bit. A LightBundle cable uses a highly multicore multimode fibre to connect a GaN microLED transmitter array to a matching array silicon photodetectors (PDs).

Arrays of hundreds or thousands of LightBundle’s microLEDs and PDs are said to be easily integrated with standard CMOS ICs, enabling the closest integration of optical interconnects with electrical circuits. In addition to high energy efficiency and high bandwidth density, these LightBundle links also exhibit low latency since the modulation format of the individual links is simple NRZ instead of PAM4 which is common in many modern optical links but has the disadvantage of higher power consumption and additional latency.

The need for next generation computing power is here, driven by strong AI/ML and HPC application demand – for products like ChatGPT, DALL-E, autonomous vehicle training, and many others. Attempts to scale current architectures are running headlong into physical limits leading to slower throughput growth, power-hungry and hard to cool systems. Avicena says its LightBundle architecture breaks new ground by unlocking the performance of xPUs, memory and sensors – removing key constraints of bandwidth and proximity while simultaneously offering an order-of-magnitude reduction in power consumption.

“We acquired our fab from Nanosys in October to accelerate our development efforts and support low-volume prototype manufacturing,” says Bardia Pezeshki, founder and CEO of Avicena. “However, we are addressing very sizeable markets requiring high-volume manufacturing. We are very pleased to partner with one of world’s top GaN LED companies to provide a path to satisfy the expected high volumes required by our customers, including hyperscale datacenter operators and the world’s leading IC companies.”

“Avicena’s LightBundle technology provides an opportunity for GaN microLEDs to impact numerous key applications including HPC, AI/ML, sensors, automotive and aerospace,” says Robert Feurle, executive VP and managing director, OS Business Unit at Ams Osram. “As a global leader in GaN LEDs, we are excited to partner with Avicena to transform these very large and important markets.”

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: