Loading...
News Article

Novel laser can transmit 200Gbps over 10km

News

Scientists from Japan develop lumped electrode electroabsorption (EA) modulator DFB laser to achieve longer distances

Scientists from Japan have developed a new type of distributed feedback (DFB) laser and showed that it can be used to transmit data at speeds of 200 Gb/s over a record distance of 10 km.

Kazuki Nishimura an optical engineer with Lumentum Japan will present the new research at the Optical Fiber Communication Conference (OFC), taking place 05 – 09 March 2023 in San Diego, California, USA.

“The research contributes to the development of next generation data centers for 800G and 1.6T ethernet. Particularly, the new technology suggests electro-absorption modulators with integrated distributed feedback (EA-DFB) lasers can work even 10-km transmission using conventional PAM4 (pulse amplitude modulation) technology, which is defined as a simple intensity-modulation direct-detection (IM/DD) scheme,” said Nishimura.

In the new work, the researchers developed a lumped electrode electroabsorption (EA) modulator DFB laser to achieve longer distances. They first used the new laser to demonstrate 5-km transmission of 225-Gb/s PAM4 using the coarse wavelength division multiplexing (CWDM) wavelength band under 50°C operation. They also used the laser for 10-km transmission of 225-Gb/s PAM4 at 1293.5 nm. This wavelength exhibits less chromatic dispersion than the wavelength range assigned to CWDM, the technology typically used to simultaneously send multiple optical signals over an optical fibre. Chromatic dispersion can cause degradation in the optical signal and is more problematic for longer transmission distances.

For all the experiments, the new laser exhibited low transmitter and dispersion eye closure quaternary (TDECQ) values, indicating solid transmitter performance. The researchers say that their results demonstrate the potential of the lumped electrode EA-DFB laser as a light source for 800G ethernet technology, including 10-km applications. It could also be useful for longer reach 5-km CWDM4 applications.

“The traffic in data centres is significantly growing annually as high-resolution video-streaming services, such as 4k and cloud applications. These results show our EA-DFBs are a promising optical light source to realize the upcoming 800GbE applications,” said Nishimura.

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: