+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

OpenLight unveils 800G DR8 PIC design to advance datacenter Interconnect industry

News

Delivering new levels of performance and scalability to accelerate the design of photonic integrated circuits (PICs) for datacom applications, OpenLight has announced the availability of its first 800G DR8 PIC design targeted at datacenter interconnects. OpenLight has fabricated and tested these wafers using the world's first open silicon photonics foundry platform with integrated lasers offered by Tower Semiconductor.

The 800G DR8 PIC design provides customers with an easy-to-use, validated approach to jump-start their transceiver production design. OpenLight's achievement with on-chip laser integration and high-speed InP-based modulators removes the need for the procurement and attachment of additional lasers into a PIC, offering scalability with high-speed performance and cost at scale to tackle complex designs. Built on Tower Semiconductor's silicon photonics production process (PH18DA), the 800G DR8 PIC design is a fully validated PIC design with an associated circuit model and available test datasets.

"As the number of users and devices per user continue to increase, the demand for bandwidth and higher data rates will only grow multifold. We are seeing an uptake in the adoption of silicon photonics and believe our first-of-its-kind 800G DR8 PIC design and available tested samples will help customers quickly design optical transceiver modules and enable faster time to market for emerging datacom needs," said Dr. Thomas Mader, Chief Operating Officer at OpenLight. "Together with Tower, we are able to consistently offer scalable design solutions and support the industry's move to 800G and beyond for datacenters with integrated lasers."

"Our partnership with OpenLight continues to add new, silicon-proven IP to Tower's existing open foundry offering, enabling customers to accelerate development of next generation silicon photonics products with fully integrated lasers," said Dr. Marco Racanelli, Senior Vice President and General Manager of Tower Semiconductor's Analog Business Unit. "The process technology and PDK are available to Tower customers along with regularly scheduled shuttle runs while higher order IP such as the 800G reference design announced here, is available through our partner OpenLight."

The 800G DR8 PIC sample kits are now available, and they come with design files to enable customization ,if desired. High-speed test data is also available. To learn more information on pricing and availability, contact OpenLight at www.openlightphotonics.com.

PIC International to return to Brussels – bigger and better than ever!


The leading global integrated photonics conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face on 18-19 April 2023

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: CS International and Power Electronics International.
  • Email info@picinternational.net  or call +44 (0)24 7671 8970 for more details.

Register

NIST and AIM team up on photonics chips
OpenLight unveils 800G DR8 PIC design to advance datacenter Interconnect industry
Characterisation of VCSELs, µLEDs and AR/VR displays
Vector Photonics fast-tracks PCSEL commercialisation
Changing the color of quantum light on an integrated chip
Jenoptik receives Thuringia Innovation Award 2022 for opto-electronic UFO Probe®Card
Silicon photonics is driven by data center applications
Scantinel lands €10M for next gen LiDAR
Improving optical coupling for hybrid photonic packaging
Wafer-level nanoimprint technology for innovative packaging
Enabling next generation photonic integration and packaging solutions
Researchers control light quanta with sound waves
The best of both worlds: Mature hybrid integration & its applications
HKUST team develops way to couple III-V and silicon
Spain could prioritize PIC manufacturing to lead in EU photonics
Yield improvement techniques in the manufacturing of AWG (Cascade) PLC
“Bringing integrated photonics to daily life”
EVG unveils EVG150 resist processing system
POET announces 800G and 1.6T Optical Engines
DigiQuant project aims to shrink laser diodes
Coherent Appoints Julie Sheridan Eng as CTO
Instrument Systems VCSEL analysis camera wins Photonics Award
ITRI and Ganvix extend GaN VCSEL venture
Nanometre components require sub-nanometre precision
Vector Photonics CTO wins UK engineering award
Lockheed Martin and Ayar Labs Partner on optical I/O
FBH exhibits space qualified laser diode modules
Vector Photonics will present posters at this year’s ISLC
Next stop for InP: consumer applications?
514 nm laser diode replaces argon-ion lasers
PCSELs take ECOC stage
Multi-junction VCSELs save power and space

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: