+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

PCSELs take ECOC stage

News

Solving data centre 800Gbps optical interconnect challenges

As data centres look to co-packaged optics (CPO) for delivering interconnects of 800Gbps and above, Vector Photonics says its all-semiconductor PCSELs are gaining increasing attention.

PCSELs are surface emitters. This is said to lead to produce better power scaling and beam divergence than conventional lasers, as well as simpler silicon photonics fabrication. PCSELs are not dependent on the base epitaxy used, allowing the flexibility to manufacture at different wavelengths, not only for multiple datacoms but also for telecoms and other CPO applications.

Following his presentation at ECOC’s 8th International Symposium for Optical Interconnects in Data Centres, Calum Hill, principal development engineer at Vector Photonics said: “The current, transceiver, optics technology used in data centres is at its limit and unable to keep pace with demand for cloud services. This is a critical moment for datacoms and one Vector Photonics PCSELs address.

"Our all-semiconductor PCSELs attracted a lot of attention and were seen as the foremost laser solution for 800Gbps optical interconnects and above."

PIC International to return to Brussels – bigger and better than ever!


The leading global integrated photonics conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face on 18-19 April 2023

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: CS International and Power Electronics International.
  • Email info@picinternational.net  or call +44 (0)24 7671 8970 for more details.

Register

NIST and AIM team up on photonics chips
OpenLight unveils 800G DR8 PIC design to advance datacenter Interconnect industry
Characterisation of VCSELs, µLEDs and AR/VR displays
Vector Photonics fast-tracks PCSEL commercialisation
Changing the color of quantum light on an integrated chip
Jenoptik receives Thuringia Innovation Award 2022 for opto-electronic UFO Probe®Card
Silicon photonics is driven by data center applications
Scantinel lands €10M for next gen LiDAR
Improving optical coupling for hybrid photonic packaging
Wafer-level nanoimprint technology for innovative packaging
Enabling next generation photonic integration and packaging solutions
Researchers control light quanta with sound waves
The best of both worlds: Mature hybrid integration & its applications
HKUST team develops way to couple III-V and silicon
Spain could prioritize PIC manufacturing to lead in EU photonics
Yield improvement techniques in the manufacturing of AWG (Cascade) PLC
“Bringing integrated photonics to daily life”
EVG unveils EVG150 resist processing system
POET announces 800G and 1.6T Optical Engines
DigiQuant project aims to shrink laser diodes
Coherent Appoints Julie Sheridan Eng as CTO
Instrument Systems VCSEL analysis camera wins Photonics Award
ITRI and Ganvix extend GaN VCSEL venture
Nanometre components require sub-nanometre precision
Vector Photonics CTO wins UK engineering award
Lockheed Martin and Ayar Labs Partner on optical I/O
FBH exhibits space qualified laser diode modules
Vector Photonics will present posters at this year’s ISLC
Next stop for InP: consumer applications?
514 nm laser diode replaces argon-ion lasers
PCSELs take ECOC stage
Multi-junction VCSELs save power and space

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: