Loading...
News Article

Rockley Photonics Unveils Next-Gen Laser Spectrophotometer Chip

News

Rockley Photonics Holdings, a supplier of photonics-based health monitoring and communications solutions, has announced that it has developed what it believes to be the world’s first micro-transfer-printed (mTP) silicon-photonics-based laser for commercial applications. This groundbreaking achievement is expected to allow Rockley to further increase the density and reduce the size of its high-density spectrophotometer chips — which are already the world’s smallest for broadband infrared wavelength laser spectrometry (covering 1000 nanometers of spectrum) and are smaller in area than LED-based solutions currently used in wearables.


Size comparison of Rockley’s new mTP laser array (Graphic: Business Wire)

This advancement could potentially have a significant impact across a wide range of applications, including the design of exceptionally small wearable devices for the detection and measurement of multiple biomarkers. New silicon-photonics-based biosensing chips using mTP technology are expected to be available in the first half of 2024. The new chip technology should have no impact on the upcoming launch of Rockley’s Bioptx™ biosensing band nor on any current-generation products that Rockley and its customers are developing.

With this breakthrough in the mTP of silicon-photonics-based lasers, Rockley has dramatically increased the laser density of its photonics integrated circuits (PICs) for biosensing, creating what it believes to be the world’s highest-density broad-wavelength laser spectrophotometer chip, surpassing its own previous achievements. Moreover, the mTP process is expected to reduce manufacturing costs and enable thinner, smaller footprint and higher-density chip designs. These attributes are powerful benefits for use in consumer and medtech devices and could facilitate the integration of Rockley’s biosensing technology into future tiny wearables.

Leveraging the mTP process, the new PIC technology will integrate a laser-generating “membrane” with a thickness of only 4 microns. The potential applications for this higher-density and smaller-footprint chip technology extend beyond biosensing and health monitoring into other areas, such as ultra-small wearables, clothing, or XR/VR/AR headsets and glasses.

This mTP breakthrough is the direct result of Rockley’s multi-year partnership with the Tyndall National Institute at University College Cork in Ireland, X-Celeprint Limited, and the Irish Photonics Integration Centre (IPIC), with funding support from the Irish government’s Science Foundation Ireland (SFI) and Disruptive Technologies Innovation Fund (DTIF). The project started five years ago with a focus on developing a custom mTP process for Rockley’s silicon photonics platform and has involved a multidisciplinary team of world-class engineers and researchers. This technology, along with many other Rockley innovations, is backed by a robust multidisciplinary patent portfolio of over 200 issued patents and 295 pending patents in total.

“Applying the micro-transfer printing process to the production of integrated lasers is a huge breakthrough that we believe will have a tremendous impact on wearable biosensing and on the photonics industry as a whole,” said Dr. Andrew Rickman, chairman and chief executive officer of Rockley. “We arguably have some of the most sophisticated photonics technology in the world, and this unprecedented level of miniaturization raises the bar even further. By creating biosensing chips that are smaller, lower-cost, and more efficient, we can continually improve our wearable biosensing products and deliver novel, relevant, and more powerful ways to monitor our health.”

“I believe that this next-gen, heterogeneous integration platform will lead to several significant technological advancements, including higher densities of lasers, increasingly smaller chip sizes, and ultra-high-volume manufacturing,” said Aaron Zilkie, chief technology officer of photonics at Rockley. “The team has been working on this project for years, and we are extremely excited to have reached this important milestone. We are grateful for the close collaboration we’ve had with our research partners and for the funding support from the Irish government and its Science Foundation Ireland and Disruptive Technologies Innovation Fund.”

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: