Loading...
News Article

SkyWater to Build Advanced $1.8B fab

News

Indiana facility will provide access to SkyWater’s development services, volume production and heterogeneous integration

SkyWater Technology has announced its plans to build a $1.8 billion US semiconductor R&D and production facility in Indiana through a public-private partnership with the State and Purdue University to pursue CHIPS (Creating Helpful Incentives to Produce Semiconductors) for America Act funding.

The Indiana facility, to be located on the Purdue campus in the Discovery Park District, will provide access to SkyWater’s development services, volume production and heterogeneous integration solutions the company currently offers in its Minnesota and Florida facilities. SkyWater offers a range of technologies and integration expertise including MEMS, photonics, CMOS and PICs for monolithic or wafer-level integrations.

The ability to make this large of an investment will be the result of SkyWater, Purdue University and the State of Indiana working together to successfully obtain federal incentives in the form of grants as defined in the CHIPS Act currently making its way through Congress. Subsequently, SkyWater will continue implementing its co-investment business model through engagements with customers, suppliers and other agencies to ensure those resources are applied to advanced capabilities, new tools and scaled production.

According to US Senator Todd Young of Indiana, “For months, state leaders including Governor Holcomb, Secretary Chambers, President Daniels, and private enterprise have partnered to create a semiconductor corridor here in the Heartland. Today’s announcement is a direct result of those efforts. In Washington, we are on the verge of passing a major investment in next generation technologies that is vital for the success of this and future projects, and that will ensure Indiana remains at the center of our high-tech national security economy.”

“This endeavour to bolster our chip fabrication facilities will rely on funding from the CHIPS Act. Federal investment will enable SkyWater to more quickly expand our efforts to address the need for strategic reshoring of semiconductor manufacturing,” said Thomas Sonderman, SkyWater president and CEO. “Through our alliance with the Indiana Economic Development Corporation and Purdue Research Foundation, we have a unique opportunity to increase domestic production, shore up our supply chains and lay the groundwork for manufacturing technologies that will support growing demand for microelectronics.”

The aim of the new SkyWater facility is to accelerate US domestic semiconductor capabilities, ensure IP security and support a more resilient and comprehensive supply chain, providing powerful competitive advantages for its US government and commercial customers. By co-locating the fab at Purdue, SkyWater and its customers will benefit from close collaboration with the university and its pipeline of talent.

“SkyWater’s investment in a new state-of-the-art semiconductor manufacturing facility at Purdue’s Discovery Park District represents a major step forward and highlights the importance of public-private partnerships in fostering a robust and thriving domestic microelectronics industry,” said Dr. Devanand Shenoy, principal director of microelectronics, Office of the Under Secretary of Defense for Research and Engineering/Critical Technologies.

“Days like today prove that Indiana’s investments in the economy of the future, infrastructure and talent development are cultivating an environment that enables innovators such as SkyWater to choose Indiana,” said Gov. Holcomb. “Our success and our mission to support industries of the future would not be possible without the incredible partnerships with our globally ranked universities, like Purdue University, helping us attract and retain quality, innovative talent.”

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: