Loading...
News Article

UPVfab Adds Micro-Transfer Printing for Hybrid Photonics

News

Massively parallel pick-and-place of large arrays of III-V semiconductors bring new heterogeneous integration capabilities for silicon photonics

UPVfab, the microfabrication facility at the Universitat Politècnica de València, Spain, has acquired a Micro Transfer Printing (MTP) system supplied by X Display Company (XDC).

The new equipment was funded by the regional government Generalitat Valenciana through project GVA/IDIFEDER/2020/028 “UPVfab Technology Pole” as part of a strategy to equip the facility for micro-fabrication in the technical disciplines of photonics, electronics, and chemical engineering.

“This Micro Transfer Printing system is part of UPVfab’s strategy to establish process flows for hybrid photonic integration,” said Gloria Micó, Facility Manager for UPVfab. “All trends in research and market evidence the importance of hybrid photonic integration, and UPVfab aims to become one of the regional hubs for combining silicon photonics and III-V semiconductors through this novel heterogenous integration process.”

X Display Company (XDC) supplies Micro Transfer Printing systems that support printing to substrates from lab-scale up to Gen 4.5 panels (1500mm x 830mm), licenses intellectual property for manufacturing microLED displays and sells MicrolC and PixelEngine components. “This UPVfab installation is the first XDC MTP system in Spain,” said Justin Brown, XDC’s VP of Operations. “XDC’s is proud to equip UPVfab and their resident companies with an MTP system that will help them develop groundbreaking new research and products.”

X-Celeprint licenses Micro Transfer Printing intellectual property for non-display applications, including compound semiconductor heterogeneous integration for photonics, wireless communications, power management and sensor three-dimensional integrated circuits (3D ICs). “MTP technology readily adds disruptive capabilities to geographically-dispersed hubs focused on R&D and high-mix, low-volume production of advanced 3D ICs and workforce development,” said Kyle Benkendorfer, X-Celeprint’s CEO. MTP systems are installed at X-FAB, Micross Components, Tyndall National Institute, Teledyne, the Naval Research Laboratory, the University of Illinois Urbana Champaign, and the University of Ghent / imec, in addition to several undisclosed leading manufacturers.

UPVfab has established strong links with industry by orchestrating and launching a resident company program in 2021, under which VLC Photonic (a Hitachi High Tech Group company) established activity in the cleanroom. “Having access to an MTP system allows for rapid prototyping with state-of-the-art equipment,” explained David Domenech, CTO for VLC Photonics. UPVfab’s resident company program expects to add two more companies in 2022.

“The program ambition is not only targeted to industrial research and product/service development, but for companies to establish their demo sites in our facility as well,” said Pascual Muñoz, Director for UPVfab. “Our infrastructure upgrade and deployment plans are to bring in tools and qualified personnel to support industrial R&D, prototyping, and small series manufacturing.”

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: