Loading...
News Article

Atotech and SEL announce partnership

News

Atotech, a specialty chemicals technology company and a market leader in advanced electroplating solutions, and Schweitzer Engineering Laboratories (“SEL”), an industry leader in the design and manufacture of digital products and systems that protect, control, and automate electric power systems, have announced that they will partner at SEL’s state-of-the-art manufacturing facility under construction in Idaho, USA.

SEL will utilize Atotech’s innovative Uniplate® equipment technology in their new 162,000 square-foot facility that will serve as home for SEL’s printed circuit board manufacturing operation. The Uniplate® family of equipment is the industry standard for horizontal inline printed circuit board processes, from desmear and metallization to flash copper plating. The lines are scheduled to be commissioned in 2022.

John Hendrickson, Senior Engineering Manager at SEL, who will oversee SEL’s new operation, said: “As we start manufacturing our own printed circuit boards, we are committed to building the most modern, environmentally friendly, and safe PCB manufacturing facility in the United States. Atotech is a leader in their field and the right partner for us. Their horizontal plating technology offers an easy approach to automation with a focus on reducing chemical usage. This will help us meet our water recycling goals.”

Atotech’s significant investment into environmentally sound solutions benefits customers’ products and their production processes. These solutions reduce water, chemistry, energy, and waste generation, while reducing costs and meeting customer expectations for future PCB manufacturing.

“We are very excited to work with SEL to realize their needs in Idaho,” said Harald Ahnert, President of the Electronics segment at Atotech. “The equipment selected by SEL combines years of Atotech engineering leadership for horizontal production equipment. The Uniplate® family brings a highly automated and environmentally sound approach to PCB manufacturing.”

SEL previously announced that local in-house production of the PCB’s used in their digital products will provide the company with more freedom to experiment and innovate. It will also increase supply-chain security and yield superior product quality.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: