+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Cadence Collaborates with GF to Advance PIC IC Design

News

Cadence Design Systems has announced a collaboration with GlobalFoundries (GF) aimed at speeding silicon photonics IC development for 5G communications, hyperscale computing, healthcare, automotive, IoT and aerospace systems. Through this collaboration, the Cadence photonics solution, an integrated electronic/photonic design automation environment (EPDA), has been optimized for the new GF Fotonix platform, its next-generation, widely disruptive, monolithic platform that is the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale.

The comprehensive Cadence photonics solution, which supports the GF Fotonix platform, consists of the Cadence Virtuoso IC Design Platform, the Virtuoso Photonics Platform, the Spectre Simulation Platform and the Voltus-Fi Custom Power Integrity Solution, which seamlessly integrate with other Cadence products and solutions. The solution offers mutual customers a production-proven design platform for electronic/photonic design, simulation and analysis, and includes a robust set of features and APIs for generating and editing complex curvilinear shapes, waveguides and other photonics components.

The GF Fotonix platform delivers optimal performance at scale. It consolidates complex processes that were previously distributed across multiple chips onto a single chip by combining a photonic system, radio frequency (RF) components and high-performance complementary metal-oxide-semiconductor (CMOS) logic in a single silicon chip.

“Through our collaboration with Cadence, we’re enabling customers to create photonics designs faster while improving power and performance and reducing system costs,” said Mike Cadigan, senior vice president for Customer Design Enablement, GF. “By combining the Cadence photonics solution with our GF Fotonix platform, customers can meet design requirements for the most urgent, complex and difficult challenges in areas such as optical networking, super and quantum computing, fiber-to-the-home (FTTH), 5G networks, aeronautics and defense.”

“In recent years, we’ve seen photonics technology move into mainstream electronic designs,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. “The comprehensive Cadence photonics solution incorporates all of the key features in a single design platform, creating efficiencies and reducing user errors. By collaborating with GF to drive adoption of our photonics solution and the GF Fotonix platform, we’re enabling mutual customers to innovate, design and deliver photonics products faster.”

The Cadence photonics solution supports Cadence’s Intelligent System Design Strategy, enabling SoC design excellence. For more information on the Cadence photonics solution, please visit www.cadence.com/go/photonicssol.

EMCORE announces integration of PICs into its products
Scottish photonics consortium wins £4.7m in UKRI funding
Yuanjie Semiconductor to supply lasers to POET
Fraunhofer IPMS announces government funding for quantum photonic chip
POET Technologies partners with Yuanjie Semiconductor Technology
SiLC announces silicon photonics systems for machine vision
Scientists develop novel optical modulators for integrated photonics
Scientists report integrated photodiodes on TFLN
Coherent wins award for innovative photonics product
FBH to present quantum technology developments at EQTC 2023
Skorpios and FormericaOE demonstrate PICs in 800G optical transceivers
EFFECT Photonics verifies fully integrated InP PIC
NASA awards grant for silicon photonics project
OpenLight and Spark Photonics partner on PIC design services
DustPhotonics announces 800G chip for hyperscale data centres and AI
Lightwave Logic Receives Industry Innovation Award
Imec announces SiGe BiCMOS optical receiver
SiFotonics announces silicon photonics 800G LPO solutions
Rockley Photonics progresses noninvasive biomarker monitoring
MantiSpectra secures €4 million for miniaturised spectrometers
Sivers to demo next-gen laser arrays at ECOC 2023
ASMPT AMICRA and Teramount collaborate on silicon photonics packaging
Quantum Computing Inc. selects Arizona site for photonic chip foundry
German government to fund ams OSRAM optoelectronic semiconductor development
Luceda Photonics introduces new PIC design software
Vodafone explores silicon photonics for future mobile networks
Coherent introduces 1200 mW pump laser module
Photonics startups invited to apply to Luminate NY accelerator
New tool could improve lithography for smaller, faster chips
InP-based lasers surpass 2.2 mm
Indie Semiconductor buys Exalos AG
New technique controls direction and wavelength of emitted heat

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: