Ranovus and TE Connectivity Demonstrate Monolithic 800G Optical Interconnect
Ranovus and TE Connectivity (“TE”) have announced that their strategic collaboration has delivered the world’s first Co-Packaged Optics (CPO) platform based on RANOVUS’ Odin 800Gbps Analog-Drive CPO 2.0 architecture with TE’s CPx fine pitch socket interposer technology. The CPO implementation, the result of a three-year development cooperation between RANOVUS and TE, showcases a fully operational co-packaged optical assembly that has been successfully socketed onto a package substrate typical of what is required for a full CPO solution. The announcement was made as part of OFC 2022, the leading optical networking event in North America.
RANOVUS’ Odin silicon photonics engine is a low latency, high density, protocol agnostic optical engine that delivers massive optical interconnect bandwidth with industry-leading cost and power efficiency. The Odin engine scales from 800 Gbps to 3.2 Tbps in the same footprint by leveraging RANOVUS’ 100 Gbps per lambda monolithic Electro-Photonic Integrated Circuit (EPIC) cores, laser platform, and advanced packaging technologies. The Odin engine addresses the critical need by hyperscalers for power efficient, high throughput and high density optical interconnect that can flexibly be integrated into next-generation data centre solutions.
“Following on our Odin Analog-Drive CPO 2.0 plaftorm and strategic partnership annoucements at OFC 2021, we are pleased to demonstrate the flexibility of our Odin 800Gbps optical interconnect platform in combination with the novel CPx fine pitch socket interposers, with superior signal integrity, developed by TE”, said John Martinho, SVP R&D of RANOVUS. “We have been at the forefront of the Co-Packaged Optics initative since 2018 and are thrilled to be able to offer our customers the flexibility of co-packaging our Odin IP cores with TE’s fine pitch sockets for both CPO and optical module applications.”
Co-packaged optics is an innovative approach that provides Nx100 Gbps PAM4 optical input/output (I/O) for Ethernet switch and ML/AI silicon in a single packaged assembly to significantly reduce the cost and power consumption of the complete system.
“It is gratifying to see the progress that Ranovus and TE have made in advancing the co-packaging state-of-the-art with this fully functioning co-packaging assembly. Ranovus’ low power high performance ultra dense Odin silicon photonics engine fully leverages’s TE’s CPx fine pitch electrical interconnect socket technology by taking advantage of the density and excellent signal integrity performance”, said Nathan Tracy, Technologist at TE. “Co-packaging is all about pushing the technology envelope and both Ranovus and TE have continued to do that in ways that can enable power reductions and density gains with a serviceable integrated assembly that can enable practical implementations.”
TE’s CPx co-package fine pitch socket interposer technology can enable integration of miniature optical engine formfactors in extreme close proximity to a packaged ASIC die. This can provide an excellent signal integrity transition to the ASIC as required for minimal equalization or in the case of an Analog-Drive architecture, reducing the need for complex equalization.
Predicted at OFC a year ago, RANOVUS and TE co-packaging technologies are now being trialed with the industry’s thought leaders in operating demonstrations. As the industry works to develop solutions that can enable power saving co-package optics and analog-drive architectures, RANOVUS and TE are demonstrating that the future is here now.
