Scintil unveils III-V augmented PIC at OFC 2022
Single-chip solution integrates III-V optical amplifiers/lasers on the backside of advanced silicon photonic circuits
Scintil Photonics, a fabless company developing and marketing silicon photonic integrated circuits, has announced it will unveil a prototype III-V-Augmented Silicon Photonic Integrated Circuit (PIC) at OFC 2022.
Scintil’s PIC is a single-chip solution comprising all the active and passive components made from standard silicon photonics available in commercial foundries, with III-V optical amplifiers/lasers integrated on the backside of advanced silicon photonic circuits.
Scintil’s solution will boost communications in data centers, High-Performance Computing (HPC), and 5G networks, prime users of optical transceivers. The optical transceiver market is expected to reach $20.9 billion in 2026, at a CAGR of 14 percent for 2021 – 2026.
“We are very pleased to announce our prototype IC at OFC this year,” said Sylvie Menezo, president and CEO of Scintil Photonics. “The close collaboration with our commercial foundry was key to achieving this fabrication milestone, resulting in unprecedented levels of integration and performance. Scintil is already working with three leading edge customers; it is fundamental to them that we can prototype and produce in commercial high-volume silicon foundries, using multi-customer standard processes.”
