Loading...
News Article

Vector Photonics makes 1300nm PCSEL arrays

News

Arrays emit four, concurrent, 1300nm wavelengths, with a SMSR (Side-Mode-Suppression Ratio) measurement of around 35dB

Vector Photonics has successfully produced 1300nm, all-semiconductor PCSELs (Photonic Crystal Surface Emitting Lasers) targeting 800Gb, datacoms applications.

The PCSEL arrays emit four, concurrent, 1300nm wavelengths, with a SMSR (Side-Mode-Suppression Ratio) measurement of around 35dB. This revolutionary development in laser capability comes as the datacoms industry meets at the OFC exhibition in San Diego, later this month.

Richard Taylor, CTO of Vector Photonics, said: “Vector Photonics’ 1300nm, compound semiconductor lasers enable new levels of PCSEL commercialisation for datacoms applications. Unlike incumbent DFB and EEL data centre laser technologies, PCSELs deliver both the high speed and high power required, in the same device. PCSELs are surface emitting, with light coming from the top of the laser not the side, which vastly reduces packaging costs.

"We now have four, 1300nm wavelengths emitting from a monolithic PCSEL array, rather than four separate chips, simplifying post-production assembly and significantly reducing packaging costs.”

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: