Loading...
News Article

Nanoscribe partners with PHIX in photonic packaging market

News

Nanoscribe Quantum X Align

Nanoscribe, a BICO company, and the Dutch photonics packaging foundry PHIX B.V. have announced a collaboration to provide on-fiber printing services to the photonic packaging industry. With Nanoscribe’s new high-performance 3D microlens printing technology with nano-precision alignment capabilities, PHIX relies on this new technological approach in their manufacturing services of standard lensed fiber arrays (LFAs). The PHIX service portfolio will then contain the manufacturing of Free Space Microoptical Coupling (FSMOC) components printed directly on fiber arrays and photonic integrated circuits (PICs). This extends PHIX’s portfolio for bringing hybrid integration into mass production.

Both partners take a multidisciplinary approach to the development of photonic packaging solutions: from simulation to design and assembly. Nanoscribe’s Quantum X align automatically aligns and prints advanced optical lenses on fiber arrays, facilitating optimized optical coupling on PIC platforms. In addition, this is a reliable solution for passive alignment of chip modules.

PHIX is thus adding a state-of-the-art manufacturing technology to provide solutions for hybrid integration of chip-to-chip and fiber-to-chip modules to its portfolio of assembly services for all major PIC platforms. “We are confident in Nanoscribe’s new, aligned 3D printing technology for producing lensed fiber arrays and lensed chips with virtually limitless optical designs,” stated Joost van Kerkhof, Chief Operations Officer (COO) of PHIX. “This will enable us to further advance integrated photonics packaging,” Van Kerkhof added

“PHIX’s extensive expertise in assembly and packaging of photonic integrated circuits is a compelling fit for Nanoscribe to jointly validate and further advance our technology in an industrial environment,”
The PHIX service is designed as a gateway to standard LFA manufacturing, facilitating entry into such markets. It is also promising for low-volume applications and markets with industry-quality components. With Nanoscribe’s technology, PHIX offers 3D-printed collimation, focusing and steering lenses on 4-32 channel fiber arrays. This is complimentary to PHIX’s offering of spot size converters (SSCs) and can cover wavelengths from 450 to 1,550 nanometers and beyond. This marks an important milestone for the photonic packaging industry.

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: