Loading...
News Article

Macom Announces new Laser Portfolio

News

New range of more than 50 products addresses 5G and data centre applications

Macom Technology has announced the production release of its new high speed laser portfolio, after the successful completion of Telcordia GR-468 qualification testing.

All products in the portfolio incorporate a new single ridge design for enhanced optical performance and use Macom’s patented Etched Facet Technology (EFT) and wafer-scale InP manufacturing capabilities which can support high volume applications, including 5G wireless infrastructure and Cloud Data centre.

“We are pleased to achieve this milestone,” said Stephen G. Daly, president and CEO “Customer feedback on our new 25 and 50 gigabit laser performance has been positive and our focus will now turn to gaining market share.”

Macom is branding the new 25Gbps and 50Gbps distributed feedback (DFB) single ridge laser portfolio as Clear Diamond Lasers. The portfolio includes over fifty laser products with wavelengths between 1260nm and 1380nm to support multiple global 5G infrastructure applications, including 1310 BiDi, CWDM6, MWDM12, LWDM12, DWDM16 and 50Gbps PAM4. The portfolio also supports 200G FR4, 100G CWDM4 and LR4 applications for Data centre networks.

Macom’s Clear Diamond Lasers product portfolio offer customers world class performance, high reliability and supply chain security. The lasers’ standardized form factor supports ease of use and design flexibility enabling shorter optical transceiver design cycle time and faster time to market. The Clear Diamond Lasers product portfolio can be paired with Macom’s high speed analogue and mixed signal chipsets to achieve leading optical transceiver performance.

All Clear Diamond Lasers products are available as bare die or in TO-Can packages and are available to support G-Temp, I-Temp and E-Temp requirements.

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: