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Webinar: Die Bonding Flexibility for Next-Gen Photonics Packaging

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Date: April 28, 2021 at 8am PST

Palomar Technologies, a global provider of total process solutions for advanced photonics and microelectronic device packaging, announced today they are offering a webinar achieving die bonding flexibility for the next-generation of photonics packaging currently in development.

Much of the semiconductor packaging industry is engaged in an exciting and growing photonics ecosystem. Anticipating a seven percent CAGR over the next five years, this clearly outpaces most other manufacturing sectors. The associated challenges of photonics packaging, specifically relating to optical transceivers, include meeting anticipated performance gains while squeezing large package functionality into smaller, more thermally efficient footprints.

Palomar Technologies’ 3880 Die Bonder provides the flexibility and versatility to handle the many challenges present in both the current and next generation of photonics packaging. Not only is the 3880 capable of a diverse range of processes from epoxy dispense, to UV snap cure, to eutectic die attach, but can scale with production volume for low volume process development to full-scale high volume production. In this webinar, Kyle Schaefer, Palomar Product Marketing Manager reviews the challenges of photonics packaging and visits Live with Martyn Davies, New Business Development from Palomar Technologies UK, at the Palomar Demo Lab in the EPIC Center in Paignton, UK. Martyn will provide a live overview of the Palomar 3880 capabilities for photonics packaging.

The webinar takes place on April28, 2021 at 8am PST. Registration is through the link below:

https://www.palomartechnologies.com/events/WEBINAR-Unparalleled-Die-Bonding-Flexibility-Next-Gen-Photonics-Packaging

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