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Webinar: Die Bonding Flexibility For Next-Gen Photonics Packaging

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Date: April 28, 2021 at 8am PST

Palomar Technologies, a global provider of total processsolutions for advanced photonics and microelectronic device packaging,announced today they are offering a webinar achieving die bonding flexibilityfor the next-generation of photonics packaging currently in development.

Much of the semiconductor packaging industry is engaged inan exciting and growing photonics ecosystem. Anticipating a seven percent CAGRover the next five years, this clearly outpaces most other manufacturingsectors. The associated challenges of photonics packaging, specificallyrelating to optical transceivers, include meeting anticipated performance gainswhile squeezing large package functionality into smaller, more thermallyefficient footprints.

Palomar Technologies' 3880 Die Bonder provides theflexibility and versatility to handle the many challenges present in both thecurrent and next generation of photonics packaging. Not only is the 3880capable of a diverse range of processes from epoxy dispense, to UV snap cure,to eutectic die attach, but can scale with production volume for low volumeprocess development to full-scale high volume production. In this webinar, KyleSchaefer, Palomar Product Marketing Manager reviews the challenges of photonicspackaging and visits Live with Martyn Davies, New Business Development fromPalomar Technologies UK, at the Palomar Demo Lab in the EPIC Center inPaignton, UK. Martyn will provide a live overview of the Palomar 3880capabilities for photonics packaging.

The webinar takes place on April28, 2021 at 8am PST. Registration is through the link below:

https://www.palomartechnologies.com/events/WEBINAR-Unparalleled-Die-Bonding-Flexibility-Next-Gen-Photonics-Packaging

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