News Article

Webinar: Die Bonding Flexibility For Next-Gen Photonics Packaging

News

Date: April 28, 2021 at 8am PST

Palomar Technologies, a global provider of total process
solutions for advanced photonics and microelectronic device packaging,
announced today they are offering a webinar achieving die bonding flexibility
for the next-generation of photonics packaging currently in development.

Much of the semiconductor packaging industry is engaged in
an exciting and growing photonics ecosystem. Anticipating a seven percent CAGR
over the next five years, this clearly outpaces most other manufacturing
sectors. The associated challenges of photonics packaging, specifically
relating to optical transceivers, include meeting anticipated performance gains
while squeezing large package functionality into smaller, more thermally
efficient footprints.

Palomar Technologies' 3880 Die Bonder provides the
flexibility and versatility to handle the many challenges present in both the
current and next generation of photonics packaging. Not only is the 3880
capable of a diverse range of processes from epoxy dispense, to UV snap cure,
to eutectic die attach, but can scale with production volume for low volume
process development to full-scale high volume production. In this webinar, Kyle
Schaefer, Palomar Product Marketing Manager reviews the challenges of photonics
packaging and visits Live with Martyn Davies, New Business Development from
Palomar Technologies UK, at the Palomar Demo Lab in the EPIC Center in
Paignton, UK. Martyn will provide a live overview of the Palomar 3880
capabilities for photonics packaging.

The webinar takes place on April28, 2021 at 8am PST. Registration is through the link below:

https://www.palomartechnologies.com/events/WEBINAR-Unparalleled-Die-Bonding-Flexibility-Next-Gen-Photonics-Packaging



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