News Article

CEA-Leti Announces 16 Papers To Be Presented At Photonics West And A Virtual Workshop On March 25


CEA-Leti, a technology research institute of CEA Tech, will present 16 papers during Photonics West 2021, March 6-11, including an invited paper, “Advanced roughness characterization for 300mm Si photonics patterning & optimization”.

In addition, the institute will host a virtual workshop, “Emerging Photonic and Integration Technologies for Healthcare” on March 25.

The one-hour event will explore coming innovations in photonics, and will include virtual stands where participants can discuss their innovations. Group-and-private chat networking will be available through text, video and audio chat.

Photonic Workshop Presentations

• CEA-Leti's vision on bioelectronics Emmanuel Sabonnadière, CEO

• New therapeutic approach for Parkinson's disease leveraging NIR light Cécile Moro, Clinatec Project Manager

• Computational microscopy for health applications Sophie Morales, Head of Imaging Systems for Biology and Health Lab

• Emerging sensors tackling environmental and medical challenge Bertrand Bourlon, Head of the Optical Sensors Lab

• The rise of quantum photonics computing and communication Ségolène Olivier, Quantum Photonics Program Manager

• Toward deep electronics and photonics integration Fabrice Guellec, Head of Smart Integrated Circuits for Imaging Lab

Register Here - See times in Tokyo, Paris and San Francisco at

Papers by Topic at Photonics West

Retinal Projections & Heads-up Display

• Transparent cube corner array manufacturing process for head up display applications

• Improved mathematical model for a dense network of waveguides and electrodes design

• Pixelated holographic reflector recording for retinal projection devices

• Analysis of new optical addressing strategies for the optimization of retinal projection display

• Experimental validation of SiN photonic integrated waveguide arrays at λ = 532nm for Augmented Reality display applications

3D Imagers (LiDARs)

• Free space 3D FMCW imaging system: towards consumer application

• Three Dimensional FMCW scanless imaging: optical challenges and solutions


• Multispectral lensless imaging in the mid-infrared for label-free identification of Staphylococcus species

• Mid infrared multispectral imaging for tumorous tissues detection

• Cavity optomechanics for trace gas detection

Silicon Photonics

• Development, calibration and characterisation of silicon photonics based optical phased array

• Si capacitive modulator integration in a 300mm silicon photonics platform using different annealing conditions

• Advanced roughness characterization for 300mm Si photonics patterning & optimization (Invited)

Healthcare Biomedical Imaging

• Optical bacteriophage susceptibility testing by SPR (Surface Plasmon Resonance)

• SOLUS: an innovative multimodal imaging system to improve breast cancer diagnosis through diffuse optics and ultrasounds

• A multi-laboratory comparison of photon migration instruments and their performances: the BitMap exercise

• Deep learning framework applied to optical diffraction tomography

• Poster: Phase imaging of supracellular structures with lens-free microscopy

AngelTech Live III: Watch the virtual event ON-DEMAND!

AngelTech Live III was broadcast live on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and features online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

The event covered the whole spectrum of key developments affecting the compound semiconductor industry. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. This was considered a roadmap for this device, along with technologies for boosting its output.

With 3 interactive sessions over 1 day AngelTech Live III proved to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



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