News Article

Aehr Receives Multi-Wafer Test & Burn-in Solution Order


Aehr Test Systems, a worldwide supplier of semiconductor
test and reliability qualification equipment, has announced it has received an
order totaling over $1.4 million from an existing customer for a FOX-XPTM
multi-wafer test and burn-in system and multiple WaferPak Contactors to perform
volume production qualification of the customers' high performance silicon
photonics devices. The total FOX solution is expected to ship prior to the end
of Aehr's current fiscal year ending May 31, 2021.

Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “This customer is a major supplier of fiber optic transceivers in
the Data Center Interconnect (DCI) market and is moving to silicon photonics
integration to address higher performance and lower cost needs of the market.
We are delighted to see them transition from our FOX-NP™ system for initial
production burn-in and stabilization of their high-performance silicon photonic
devices to using our production FOX-XP system to meet their high-volume
production forecast. The DCI market includes DCI-Long Haul from city to city,
DCI-Metro from Data Center to Data Center within a city, and DCI-Campus/Edge
for high bandwidth transmission between multiple data centers within a campus
or used to connect regional, distributed data centers. The five year cumulative
average growth rate (CAGR) of the DCI market is expected to grow at over 55%
from 2019 to 2023 alone according to Cignal AI. This is now our sixth customer
in the silicon photonics space that is using our FOX platform for qualification
and production.

“This is a 100% production test application, so unlike a
sampling burn-in process step, this customer is using the FOX system to
stabilize each device as a critical production process step, and will need
incremental capacity for FOX systems and WaferPaks with each increment in their
volume production forecast. Our high volume, high power production FOX-XP
system is capable of testing up to 9 high-power wafers in parallel to meet
their production needs. With up to 2,000 watts of power per wafer, and the
ability to test thousands of individual devices in parallel with our WaferPak
full wafer contactor, the FOX-XP solution can test all devices on each wafer in
parallel in a single touchdown. The FOX-XP is 100% compatible with our
dual-wafer FOX-NP and proprietary WaferPaks, which allow our customers to make
a very simple transition between initial qualification and low volume
production to high volume production.

“We are excited to see this new wave of capacity needs from
our silicon photonics customers, and to see the resumption of orders to these
customers for devices for data center and 5G infrastructure expansions that is
driving the increased test capacity need. We continue to be very optimistic about
the silicon photonics market, which is seeing increasing deployment of devices
used in the expansion of bandwidth and infrastructure to meet the explosive
growth of data center and 5G. Silicon photonics devices are highly integrated
silicon based semiconductors that have embedded or integrated the non-silicon
based laser transmitters and receivers to enable a smaller, lower cost, higher
reliable alternative to traditional fiber optic transceivers currently used in
data center and telecommunication infrastructure.

“Silicon photonics devices all need to have their photonics
transmitters stabilized under high power and temperature and customers also use
our systems to screen for infant mortality of these devices to ensure high
initial quality and long-term reliability. This is a manufacturing step done on
100% of the die, and in the case of silicon photonics we provide a much more
cost effective and scalable solution for this step than doing this equivalent
stabilization and screening after the die are put onto the final PCB substrate
and package. Market research company Yole Dévelopement predicts the silicon
photonics market will grow at a CAGR of 42% between 2019 and 2025 to a $3.6
billion annual market and we believe that the industry will transition to wafer
level or singulated die for this critical manufacturing step, which is where
our FOX-P products stand alone as the most cost-effective solution for this on
the market”

The semiconductor industry today exceeds $400 billion per
year with a single CMOS chip containing billions of transistors, forming
complex circuits that are still 100% electrical. Using photons instead of
electrons, silicon photonics brings optical communications into the fabrication
space of the semiconductor industry, enabling low-cost, high-volume assembly
and the capability to bring faster, smaller, interconnects, which consume less
power and offer the entire semiconductor industry a whole new world of
opportunities. Silicon photonics is expected to be the most scalable optical
transceiver technology available while delivering lowest cost per bit for 100Gb
and higher transfer speeds. Next generation data centers, high performance
computers, and eventually consumer video products will all benefit from optical
interconnects built from silicon photonics.

The FOX-XP system, available with multiple WaferPak™
Contactors (full wafer test) or multiple DiePak™ Carriers (singulated
die/module test) configurations, is capable of functional test and
burn-in/cycling of integrated devices such as silicon carbide power devices,
silicon photonics as well as other optical devices, 2D and 3D sensors, flash
memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other
leading-edge ICs in either wafer formfactor, before they are assembled into
single or multi-die stacked packages, or in singulated die or module

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