Loading...
News Article

Bay Photonics Targets Fine Pitch Placement of Flip-Chip Photonics Devices

News

Palomar Technologies has announced that Bay Photonics is working on projects that require the placement and bonding of flip-chip photonics devices that require the use of specialized equipment and are using a Palomar 3880 die bonder in the process.

Bay Photonics, a UK-based company specializing in advanced photonics assembly and packaging is involved in the prototype development stage of projects requiring fine pitch of hundreds of bonding pads, some at 60-micron level. The Palomar 3880 die bonder recently purchased by EPIC Paignton is being utilized to ensure that the final layout of the photonic ICs (PICs) is suitable for the targeted assembly and packaging processes.

Glenn George, Managing Director of Bay Photonics commented: “I am particularly pleased that prospective customers have contacted us to help with these highly accurate PIC assembly and packaging projects. It’s exciting to see that the idea of creating a hub for Photonics development at EPIC is working, not only from Bay Photonics perspective of moving to this fantastic building, but also involving the eco-system that EPIC brings, using machinery that Palomar have commissioned and the willingness of EPIC and Palomar Technologies to help accomplish these advanced photonics technology requirements.”

Bay Photonics founded with former employees of Nortel/Bookham, Gooch & Housego, and Eltek Semiconductor have a deep understanding of the capabilities are of the various assembly methods for specific photonics applications and how to use that knowledge for building commercial prototypes that could transition to production volumes if so desired.

Josef Schmidl, Managing Director EMEA for Palomar Technologies said, “We are thrilled to work closely with Bay Photonics, particularly in this area of advanced photonics packaging. Today’s photonics applications are becoming extremely complicated and with our vision to create simple solutions for complex processes, we are dedicated to finding solutions for our customers. Our focus in placing our equipment with EPIC is to enable our customers to realize the high growth potential opportunities that are available in these exciting, rapidly evolving industry sectors.”

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: