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PIXAPP Launches New Prototype Packaging Platforms

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PIXAPP, the world's first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, today announced the introduction of two new prototype packaging platforms to enable the early-stage testing and evaluation of integrated photonic devices.

The PIXAPP Grating Coupler Based Generic Packages (PIXAPP-GCP-10 and PIXAPP-GCP-100) are now available to users that need fast and cost-effective PIC packages with 10s to 100s of electrical connections. “Off-the-shelf” designs are available in volumes from 5 to 1000 units for rapid prototyping using the PIXAPP-GCP-10 design. For PICs with larger electrical and optical connections, the more flexible PIXAPP-GCP-100 design is available. These prototype packages add to PIXAPP's established advanced photonic packaging services, helping users speed-up the development of their new photonic-based products. The prototype packages offered are based on PIXAPP's standardised packaging building blocks, including standardised optical and electrical interconnects, thermal and mechanical components.

Since 2017, PIXAPP has led and coordinated efforts with Europe's leading photonics research institutes and companies to standardise advanced packaging processes and coordinate the manufacturing supply chain, working with design houses, device foundries, companies providing packaging components and services, and manufacturers of automated packaging equipment.

“We are excited about the launch of these new standard prototype packages that support companies in the early stage of product development and evaluation. We believe these packages will benefit users across many application areas, including optical communications, medical devices and other emerging industrial markets” said Peter O'Brien, director of the PIXAPP Pilot Line.



2nd November 2020 - 10am GMT (Live event)
4th November 2020 – 10am CTT (Recorded)
6th November 2020 – 10am PST (Recorded)


Following on from the successful launch of the virtual AngelTech Online Summit in May 2020, we are delighted to announce AngelTech Live II, taking place on 2 November 2020. AngelTech will once again consist of our established events of CS International and PIC International.

The 2nd virtual summit will utilise an enhanced event engine, integrating presentations, digital sponsors booths and the networking tools into one portal – allowing for live chat between delegates, speakers and sponsors.

The event will take the form of three interactive sessions over 1 day and will be a must attend live summit consisting of:

  • Analyst talks
  • Industrial research
  • End user presentations
  • Dedicated breakout room for partner presentations

MORE INFO     REGISTER FOR FREE     WATCH OUR MAY EVENT ON-DEMAND

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