Loading...
News Article

NeoPhotonics Announces HB-CDM for data centre interconnect

News

Enables customers to implement single channel 600G data transmission over distances of 80 km using 64 QAM

NeoPhotonics, a manufacturer of photonic integrated circuit based lasers, modules and subsystems, has announced general availability and volume production of its 64 GBaud High Bandwidth Coherent Driver Modulator (HB-CDM).

This CDM joins NeoPhotonics a 64 GBaud Intradyne Coherent Receiver (ICR) and ultra-narrow linewidth tunable laser to enable customers to implement single channel 600G data transmission over data centre interconnect (DCI) distances of approximately 80 km using 64 QAM. These components also support 400G over metro distances of 400-600 km using 64 GBaud and 16 QAM or 200G over long-haul distances of greater than 1000 km using 64 GBaud and QPSK.

NeoPhotonics HB-CDM is implemented in a small form factor (25 x 12 x 5 mm) package which co-packages a linear, quad-channel, differential 64 GBaud driver with an InP based Mach-Zehnder (MZ) quadrature modulator chip. It provides efficient coherent multi-level modulation formats, such as DP-QPSK, DP-16QAM and DP-64QAM, to support coherent transmission up to 64 GBaud. The HB-CDM is compliant to the OIF’s Implementation Agreement OIF-HB-CDM-01.0 'High Bandwidth Coherent Driver Modulator', and assures users a 3dB EO bandwidth of greater than 40GHz. The compact size fits in a CFP2-DCO pluggable module.

NeoPhotonics HB-CDM is also available in a 'C++' CDMTM Modulator version, which supports tuning across the full 'Super C-band' covering 6.4 THz of spectrum or up to 50 percent more than standard systems. The C++ CDMTM Modulator, Ultra-Narrow Linewidth Tunable C++ LASERTM Micro-ITLA and 64 GBaud C++ ICRTM Receiver are combined in NeoPhotonics C++ CFP2-DCO transceiver, which is a pluggable transceiver module able to deliver as much as 34 Terabits of capacity per fibre. This module can support 85 channels of 64 GBaud data at 75 GHz channel spacing and effectively increases the capacity of an optical fibre by as much as 50 percent over standard systems at comparable distances.

"We are pleased to add the HB-CDM to our suite of components for 64 GBaud coherent systems which are currently shipping in volume to multiple customers," said Tim Jenks, chairman and CEO of NeoPhotonics. "The HB-CDM is based on our InP photonic integration platform and delivers the high performance for demanding applications. Combined with our Silicon Photonics integration platform we can provide customers with the optimized solutions to meet their network requirements for the highest speeds and at volume scale."

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: