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Ranovus Launches Single Chip Odin Photonic Engine

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Supports machine learning and AI workloads for data centre and 5G mobility

Ranovus Inc, a Canadian provider of multi-terabit interconnect solutions for data centre and communications networks,has announced the launch of its Odin platform. Odin scales Ranovus' 100 Gbps per lambda silicon photonics engine from 800 Gbps to 3.2 Tbps in a single chip supporting both module and co-packaged optics solutions.

Ranovus' Odin platform incorporates the company's disruptive innovation in multi-wavelength quantum dot laser (QDL), 100 Gbps silicon photonics based micro ring resonator modulators and photodetectors, 100 Gbps driver, 100Gbps TIA and control Integrated Circuits supported by a Tier 1 packaging ecosystem.

“ML/AI are the driving forces behind innovation in our society. They have created new compute, storage and networking paradigms inside and outside the data centre. The massive growth in data traffic fuelling the algorithms requires scalable and power efficient networking technologies. Odin platform delivers 50 percent power consumption/Gbps reduction and 75 percent cost/Gbps reduction over today's solutions,” said Hamid Arabzadeh, chairman and CEO at Ranovus. “Odin 8 marks the beginning of the road to multi-terabit co-packaged optics for compute, storage and networking solutions.”

“Intra-Data centre traffic is growing at a rate that outpaces anything seen outside of the data centres and is expected to triple in the next five years. This growth in traffic is driving global energy consumption, for power and cooling, that is simply not sustainable at the current trajectory. At Ranovus, we're dedicated to developing energy and space efficient technologies to address this critically important challenge - starting with our Odin optical engine platform,” said John Martinho, SVP R&D at Ranovus. “We're proud to have brought together a Tier 1 ecosystem of partners and industry veterans to make these innovations possible.”

PIC International 2020 - New Dates Announced.

JOIN THE MARKET LEADING GLOBAL INTEGRATED PHOTONICS CONFERENCE AND EXHIBITION TODAY!

In light of the global Coronavirus pandemic, we have rescheduled AngelTech, comprising, PIC International, co-located with CS International, and SSI International to 17TH and the 18th November at the Sheraton Airport Hotel, Brussels, Belgium

In its fifth year, PIC International has become the definitive global integrated photonics conference, providing comprehensive coverage of the industry.

2020 will be no exception and is set to be even bigger and better!

Bringing together 3 conferences, 800+ delegates, 80+ exhibitors, 120+ presentations and numerous networking opportunities, AngelTech is the number one global event covering compound semiconductor, photonic integrated circuit and sensor technologies. With a strong over-lap between the three conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.

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