Circuits Multi-Projets (CMP) and TEEM Photonics have announced that TEEM Photonics processes willnow be made available for prototyping and low volume production through CMP. The new agreement lets CMP offer to Universities, research labs and industrial companies the access to design and manufacturing of photonics circuits on glass substrates. In addition, the offer comes with a wide range of coupling and packaging solutions that maybe used for assembly of silicon-photonics chips and optical fiber. Devices like glass adapters(WAFT Waveguide Array for Fiber Transposer), can be available as a standard product or can be designed as a custom device.

Customers who need to design and integrate different components and functions on a glass substrate will have access to PDK (Process Design-kit) which includes a library of characterized and qualified components. The PDK also allows to design custom components with or without the standard components. The integration of the components in a single design gives the possibility to elaborate high-performance photonics chips for both the visible and infrared domains.

The agreement lets CMP distribute TEEM Photonics technologies as a foundry service center. Customers can reach out CMP to have access to PDKs (Process Design-kits) for designing their circuits, and send their tape-outs to CMP for manufacturingat TEEM Photonics. Applications addressed by the offer cover datacom & telecom, sensing and many other industrial and scientific R&D activities."The CMP -TEEM Photonics partnership provides users with unique solutions on photonics integrated circuits on glass. This is a differentiated foundry offer which complements the photonics servicesoffered by CMP.

It opens new opportunitiesfor young engineers in Universities, and new business for small industry", says Kholdoun Torki, Director at CMP."The availability of ioNext technology through CMP services will ease its access to the scientific and engineering community. Glass integrated photonics is the technology of choice to get both very low propagation loss and compact integrated design for robust and temperature stable photonics circuit in visible and near infrared spectrum", says Arnaud Rigny, Head of ioNext business line at TEEM Photonics.

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