Loading...
News Article

FBH to exhibit latest tech at Photonics West

News

Company to show a novel terahertz camera sensor in addition to its established diode-laser-based light sources

The Ferdinand-Braun-Institut (FBH) is presenting its developments and advancements in diode lasers and UV LEDs at Photonics West 2020, San Francisco (USA), February 4-6, 2020.

At the German Pavilion, FBH will show its full range of capabilities, from design through chips to modules and prototype systems. BeamXpert, another FBH spin-off, demonstrates its software, enabling real-time simulation of laser radiation in optical systems. FBH is also represented at the accompanying conferences (1st to 6th February) with 20 scientific contributions.

In addition to its established diode-laser-based light sources, FBH will exhibit a terahertz camera sensor that operates in a broad frequency range between 500 - 2500 GHz. It offers high sensitivity of NEP ≤ 50 pW/Hz0.5 along with a fast response time. This makes it suitable for imaging systems used for quality control in industrial applications. It can also be integrated into medical equipment, e.g., for diabetes diagnostics and spectroscopy.

Further exhibits will include high-power diode laser stacks for high duty cycle industrial operation; next generation LiDAR laser sources for line scanners (pictured above); and a compact dual-wavelength laser turnkey system for Shifted Excitation Raman Difference Spectroscopy (SERDS).

Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: