Info
Info
News Article

Plan Optik Driving Connectivity To The Next Level

News

Plan Optik AG, manufacturer of customized wafers from glass, quartz or glass-silicon compound materials launched its new Cu-Interposer technology at SEMICON Europa 2019.

The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient communication with high transmission rates in the 3D chip stack or 3D system package. At present, organic interposers are predominantly used for these technologies. Organic interposers can be produced inexpensively, but are no match for the modern and increasing demands on 3D integration and high transfer rates. Through Glass Via Wafers (TGVs) offer a cost-effective alternative to the costly silicon interposer technology. TGV interposers are a promising technology for three-dimensional and high-density hybrid integration. For high-frequency applications and optoelectronic components, insulation layers are integrated and therefore not required compared to silicon technology of IC chips.

But: There is no established solution to produce glass interposers at wafer level, which provides all the required properties for high-frequency applications. For this reason, Plan Optik has developed a new technology to produce interposers with an applied copper layer, which is particularly suitable for high-frequency applications.

Next Generation Interposer

As a first step, Plan Optik will be able to offer Interposers as drilled glass wafers with a copper layer. Those Interposer wafers will be available in sizes up to 300 mm with hole diameters down to 100 µm (depending on wafer thickness). At present, customized Redistribution Layers (RDL) can be integrated on wafer sizes up to 8”. The wafer thickness ranges from 200 µm up to 1 mm. Plan Optik's Cu-Interposer can be produced as a wafer, as panels or as boards depending on customer needs. With a minimum hole distance equal to via diameter and a Cu-layer thickness starting from 1 µm Cu-Interposer are perfectly suitable for high-frequency applications like for example 5G broadband transmission, radar and imaging sensors, biosensors or beam steering networks.



2nd November 2020 - 10am GMT (Live event)
4th November 2020 – 10am CTT (Recorded)
6th November 2020 – 10am PST (Recorded)


Following on from the successful launch of the virtual AngelTech Online Summit in May 2020, we are delighted to announce AngelTech Live II, taking place on 2 November 2020. AngelTech will once again consist of our established events of CS International and PIC International.

The 2nd virtual summit will utilise an enhanced event engine, integrating presentations, digital sponsors booths and the networking tools into one portal – allowing for live chat between delegates, speakers and sponsors.

The event will take the form of three interactive sessions over 1 day and will be a must attend live summit consisting of:

  • Analyst talks
  • Industrial research
  • End user presentations
  • Dedicated breakout room for partner presentations

MORE INFO     REGISTER FOR FREE     WATCH OUR MAY EVENT ON-DEMAND

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}