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Marktech Introduces Broadband Hybrid Silicon-InGaAs Photodetectors

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Wide dynamic range includes 365nm blue-green enhanced silicon-based and 1300nm InGaAs-based detection

Marktech Optoelectronics, a privately-held, VOSB-certified, designer and manufacturer of standard and custom optoelectronics components and assemblies, including ultraviolet (UV), visible (VIS), near-infrared (NIR), and short-wave infrared (SWIR) emitters, detectors, InP epiwafers and other materials, has announced the introduction of its Models MT03-041 (TO-5) and MT03-047 (SMD), two new broadband hybrid silicon-InGaAs photodetectors.

The design of the Models MT03-041 and MT03-047 is said to ensure versatile, accurate, reliable broadband detection over spectral ranges from UV-to-VIS-to-SWIR, with 250 nm (UV) to 1750 nm (SWIR) enhanced sensitivity. This wide dynamic range includes 365 nm blue-green enhanced silicon-based and 1300 nm InGaAs-based detection, respectively; ultra-low-noise measurement performance; and high shunt resistance. The detectors are seamlessly integrated within a single, compact thru-hole or SMD package. They are also both REACH and RoHS compliant.

Small-to-medium-sized quantities of standard Models MT03-041 (TO-5) and MT03-047 (SMD) are typically available with 24-hour shipment from stock via Marktech global distribution partner, Digi-Key Electronics.

Optional accessories for Models MT03-041 (TO-5) and MT03-047 (SMD), also available from Marktech, include UV-to-IR-to-SWIR range emitters. Each emitter may be mechanically and spectrally matched, then combined with the photodetector as a single, compact package. Custom designs may be produced in as few as 6-8 weeks from customer prototype approvals.

AngelTech Online Summit is now available to watch ON-DEMAND!

AngelTech Online Summit witnessed over 900 registrants for the digital event, which took place virtually on Tuesday 19th May.

The Summit was designed to ensure the global compound semiconductor, integrated photonics, sensors and PIC pilot lines communities could stay connected and would serve as a significant supplement to the annual Brussels face-to-face conference, rescheduled for 17th and 18th November, 2020.

The event included 4 breakout sessions for CS International, PIC International, Sensors International and PIC Pilot Lines respectively.

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