Loading...
News Article

Cardiff University team develops nanolasers on silicon

News

First demonstration showing how photonic band-edge lasers can be integrated directly on patterned silicon-on-insulator platforms

Researchers at Cardiff University have shown tiny light-emitting nanolasers less than a tenth of the size of the width of a human hair can be integrated into silicon chip design.

The photonic band-edge lasers can operate at superfast speeds and have the potential to help the global electronics industry deliver a range of new applications – from optical computing to remote sensing and heat seeking,

“This is the first demonstration that shows how photonic band-edge lasers can be integrated directly on patterned silicon-on-insulator platforms,” said Diana Huffaker scientific director of Cardiff University’s Institute for Compound Semiconductors (ICS). Huffake specialises in nanoscale epitaxy, fabrication and optoelectronic devices.

“Silicon is the most widely used material in semiconductor industries. However, it has been difficult to integrate compact light sources on this material. Our research breaks through this barrier by developing extremely small lasers integrated on silicon platforms, applicable to various silicon-based electronic, optoelectronic, and photonic platforms.”

The paper, 'Room‐Temperature InGaAs Nanowire Array Band‐Edge Lasers on Patterned Silicon‐on‐Insulator Platforms', has been published in Physica Status Solidi - RRL.

Wyn Meredith, director of the Compound Semiconductor Centre, a Joint Venture between IQE Plc and Cardiff University, said: “This research will have long-term implications in the rapidly expanding field of photonics, with a particular emphasis on driving commoditisation of high volume, high specification optical components for mass market communications and sensing applications.“

Cardiff University, IQE and the Compound Semiconductor Centre are members of CS Connected – the world’s first hub for compound Semiconductor technologies based in South Wales.

The ICS is due to move to a new state-of-the-art Translational Research Facility on Cardiff Innovation Campus in 2021.

Quintessent appoints Bob Nunn chief operating officer
PI to demonstrate new PIC alignment system at Photonics West
Drut launches 2500 product series with CPO for AI datacentres
III-V Epi advocates GaAs for new lasers
Marvell announces new CPO architecture for custom AI accelerators
Printing high-speed modulators on SOI
Photon IP raises €4.75m for advanced PICs
ANELLO Photonics launches Maritime Inertial Navigation System
Aeluma joins AIM Photonics as full industry member
Imec makes breakthrough with GaAs lasers on silicon
POET acquires Super Photonics Xiamen
Voyant Photonics launches affordable Carbon LiDAR
Penn State makes breakthrough in photonic switching
New nanocrystals could lead to more efficient optical computing
QCi awarded NASA contract to apply Dirac-3 photonic optimisation solver
The Netherlands launches ChipNL Competence Centre
TOPTICA to create chip-integrated lasers for quantum PIC project
NSF selects six pilot projects for National Quantum Virtual Laboratory
SiLC Technologies launches Eyeonic Trace Laser Line Scanner
Southwest Advanced Prototyping Hub awarded $21.3 million CHIPS Act funding
Cambridge Graphene Centre and CORNERSTONE to participate in PIXEurope
Cost-effective lasers for extended SWIR applications
IBM unveils co-packaged optics technology for AI and datacentres
QCi announces $50 million concurrent stock offerings
CHIPS Act funding to be awarded to Coherent, Skywater, and X-Fab
ERC consolidator grant awarded for optoacoustic neural network project
Imec demonstrates InP chiplet integration on 300 mm RF silicon interposer
Ayar Labs raises $155 million for optical I/O
Celestial AI awarded 2024 Start-up to Watch by Global Semiconductor Alliance
Researchers develop “last missing piece” of silicon photonics
Quantum sensors for controlling prosthetics
UPVfab to participate in European Commission photonic chips project

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: