Loading...
News Article

Industry Leaders to Develop New PIC Testing Capabilities

News

ficonTEC Service and Coherent Solutions have agreed to collaborate in the development of advanced electro-optical measurement capabilities designed to enable automated volume testing of photonic integrated circuits (PICs).

ficonTEC Service GmbH of Achim, Germany, and Coherent Solutions of Auckland, New Zealand, have announced that the two companies have entered into a collaborative partnership to advance electro-optical measurement capability for use in volume testing within the manufacturing cycle of photonic integrated circuits (PICs).

As optical and electrical technologies become more miniaturized, complex, and increasingly integrated with one another’s underlying architecture, the more inefficient and frustrating it is for process engineers to implement separate electrical and optical test and qualification procedures, the companies stated in their press announcement. To avoid this, engineers require fully-automated systems that can perform complex precision alignment and assembly, as well as combined electro-optical I/O (input/output) measurements for complex integrated photonic devices – from singulated dies, through to wafer-level and even up to fully-packaged devices.

According to Ignazio Piacentini, Business Development Director at ficonTEC, “Wafer-level testing of PICs differs substantially from that of conventional semiconductor wafers and requires the integration of three major ingredients: Firstly, high-accuracy, sub–µm optical positioning with fast-active alignment capabilities. Secondly, some form of combined electro-optical probe head, and thirdly, modular high-channel-count instrumentation. ficonTEC and Coherent Solutions already provide the necessary capabilities for the first and last ingredients, and together we are actively researching electrical/optical probe head concepts.”

Coherent Solutions’ broad portfolio of photonic test and measurement instruments includes a line-up of modules for the popular PXI platform that leverage National Instruments’ established LabVIEW graphical programming environment. As ficonTEC’s PCM (ProcessControlMaster) software is also based around LabVIEW, integration of the two is seamless and enables the creation of sophisticated and fully-automated test solutions to match individual requirements.

Alternatively, to achieve the same goal within non-LabVIEW and alternative instrumentation environments, Coherent Solutions additionally offers the same optical measurement capability in a range of compact, modular benchtop and IOT-focused test equipment that can be equally well interfaced to ficonTEC’s process control software. Either approach can be flexibly used by manufacturers to speed up development and production of the latest photonic integrated circuits and devices.

Andy Stevens, CEO of Coherent Solutions says, “The last 20 years of investment into technology for optical communications is now spawning new capabilities and products in new applications and markets, which in turn encourages further development and innovation. We are fortunate to support this innovation and are incredibly excited to work with ficonTEC on new automated test and measurement solutions for manufacturers. Our complementary product platforms and design philosophies enable rapid customization and deployment and provide a clear upgrade path as technology advances and products evolve. For customers, this increases ROI and helps them bring new products to market faster and cheaper. Together, we will provide customers with unique products and unrivalled value and support.”

Torsten Vahrenkamp, CEO of ficonTEC Service added, “The collaboration with Coherent Solutions could not come at a better time, as a number of our current activities are geared to further improving performance and capability for our new, next-generation assembly and test systems. By integrating Coherent Solutions’ innovative optical instrumentation and software into our modular machine architecture and process control software, respectively, we take a significant step forward in our continued and growing support for integrated photonics developments worldwide.”

The two companies are initially focusing their sights on manufacturers of modules and components for telecom and datacom, and on systems for testing high-density VCSEL systems as used in 3D optical sensing/imaging applications, such as for automotive LIDAR and for face recognition modules found in smartphones.

ficonTEC and Coherent Solutions will display the initial results of this collaboration with a live demonstration of a fully-automated photonics test system at NIWeek in Austin, TX/USA, from May 20-23, and again at Laser World of Photonics in Munich, Germany, from June 24-27, 2019.


Lightwave Logic receives ECOC Innovation Award for Hybrid PIC/Optical Integration Platform
Coherent wins ECOC award for datacentre innovation
HyperLight announces $37 million funding round
Jabil expands silicon photonics capabilities
Ephos raises $8.5 million for glass-based photonic chips
Designing for manufacture: PAM-4 transmitters using segmented-electrode Mach-Zehnder modulators
OpenLight and Epiphany partner on PIC ecosystem
NewPhotonics and SoftBank team up on advanced photonics
POET and Mitsubishi collaborate on 3.2T optical engines
Integrated photonic platforms: The case for SiC
Integrating high-speed germanium modulators with silicon photonics and fast electronics
Lightium Secures $7 Million Seed Funding
Revolutionising optoelectronics with high-precision bonding
Fraunhofer IMS invites participation in PIC engineering runs
Advances in active alignment engines for efficient photonics device test and assembly
Aeva announces participation at IAA Transportation 2024
Sumitomo Electric announces participation in ECOC 2024
Quside receives NIST certification for quantum entropy source
DustPhotonics launches industry-first merchant 1.6T silicon photonics engine
Arelion and Ciena announce live 1.6T wave data transmission
DGIST leads joint original semiconductor research with the EU
POET Technologies reorganises engineering team
A silicon chip for 6G communications
South Dakota Mines wins $5 million from NSF for Quantum Materials Institute
HieFo indium phosphide fab resumes production
Coherent launches new lasers for silicon photonics transceivers
AlixLabs wins funding from PhotonHub Europe
Sandia National Labs and Arizona State University join forces
Perovskite waveguides for nonlinear photonics
A graphene-based infrared emitter
Atom interferometry performed with silicon photonics
A step towards combining the conventional and quantum internet

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the PIC Magazine, the PIC Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: