News Article

PHIX Photonics Assembly secures next round of financing, LioniX International obtains a majority share

Tuesday 10th July 2018

PHIX Photonics assembly (PHIX) moves forward in the next step of its growth due to the recent acquisition of LioniX International BV by Magic Micro Co. Ltd . As part of this acquisition and the further implementation plan towards high volume assembly of Photonic Integrated Circuit (PIC) modules, LioniX International has increased its share in PHIX. This will strengthen its position as a vertical integrated supplier of PIC based modules.

In parallel to this change in ownership, PHIX also secures financial support for the upscaling from semi- automated to fully-automated assembly lines. Both Magic Micro and Panthera International (the original main shareholder of LioniX International) are committing to financially support PHIX for further upscaling. This growth is needed to serve current customers and market demands.

"˜This participation will enable us to serve our worldwide customers for moving from prototyping to high volume manufacturing of PIC based modules', said Hans van den Vlekkert, CEO of LioniX International.

"˜With this investment we can boost our growth in the PIC assembly arena, this will specifically accelerate the implementation of our automated assembly lines', said Albert Hasper, CEO of PHIX

"With this increased participation the position of Magic Micro in the field of integrated photonics is further strengthened. We now can offer our Korean customers a complete solution from prototyping to high volume production for PIC based products", said William Jang, CEO of Magic Micro.

Details of the financial support are not disclosed.

PHIX photonics assembly

PHIX supplies the photonics industry with assembly and packaging services for Photonics Integrated Circuits. The photonics industry is one of fastest growing industries at moment and can be compared with the electronics industry of the 70â€™s during the introduction of the ICs. In photonic integration there are three main technology platforms and each has its preferred application areas. Silicon, InP, and TriPleX. Combining these different platforms by hybrid integration even enhances the possible application of photonic integration into the fast growing markets like tele- and data-communication, life science, automotive and consumer electronics. The main challenge for combining the PIC platforms is in the hybrid integration of the various PICs in one package. Not only have the PICs to be connected to optical fibers and electrical connections but also they have to be interconnected. This is the main focus of PHIX: to supply PIC manufacturers for assembly of their PICs and package them into qualified modules for their OEM customers.

http://phix-photonics-assembly.com

LioniX International:

LioniX International offers a complete supply chain of PIC technology, delivering full modules to its OEM customers. This vertical integration allows a focus on volume PIC applications for worldwide customers by enabling more rapid advancement from R&D concepts towards high-volume integrated solutions. The full, vertical integration allows a true one-stop-shop service to the customers. The company has a strong focus on PIC activities; however, LioniX International will continue to offer and expand its microfluidics, optofluidics and MEMS services to its customers, thereby enabling them to also profit from the vertical integration of a â€œone stop shop.â€

PHIX Photonics Assembly secures next round of financing, LioniX International obtains a majority share

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